XDR DRAM Surpasses 100 Million Units Shipped

Award-winning memory architecture ideal for high-performance, power-conscious computing and consumer applications

Los Altos, California, United States -- Juune 10, 2009 --  Rambus Inc. (NASDAQ:RMBS), one of the world's premier technology licensing companies specializing in high-speed chip architectures, today announced that its customers have shipped over 100 million XDR™ DRAM devices worldwide. XDR DRAM is part of a total memory solution developed by Rambus. The award-winning XDR memory architecture achieves an order of magnitude higher performance than today's standard memories. With the flexibility to provide more bandwidth at better power efficiency per device than competing technologies, XDR memory both reduces overall systems costs and delivers the performance needed for the most advanced electronic products.

"Consumers' demand for increasingly powerful graphics and computing applications require superior memory bandwidth and power efficiency," said Sharon Holt, senior vice president of Licensing and Marketing at Rambus. "The XDR memory architecture has proven an ideal solution for a broad range of products needing blazing fast speeds and excellent power efficiency. No other memory technology provides the flexibility the XDR architecture offers to system and chip designers."

The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); Octal Data Rate (ODR) technology that transfers eight bits of data each clock cycle; FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for both enhanced signal integrity and scalability.

Key components enabling the breakthrough performance of the XDR memory architecture are:

• XDR DRAM is a high-performance memory that turbo-charges standard CMOS DRAM cores with a high-speed interface capable of 7.2Gbps data rates providing up to 28.8GB/s of bandwidth with a single DRAM device.
• XIO controller IO cell provides the same high-speed signaling capability found on the DRAM, but adds additional enhancements like FlexPhase™ technology that eliminates the need for trace length matching.
• XMC memory controller is a fully synthesizable logical memory controller that is optimized to take advantage of innovations like Dynamic Point-to-Point which provides for capacity expansion while delivering the signal integrity benefits of point-to-point signaling.
• XCG clock generator provides the system clocks with four programmable outputs and is guaranteed to meet the clocking requirements for the XIO and XDR DRAM devices.

XDR DRAM is available from world-leading memory suppliers Elpida Memory Inc. and Samsung Electronics Co. Ltd. It has been adopted in high-volume products including the Sony PLAYSTATION®3 computer entertainment system, DLP® projectors, Teradici PC-over-IP computing systems, and Toshiba's Qosmio® laptop PCs and HDTV chip sets. For more information on the XDR memory architecture please visit www.rambus.com/xdr.

About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, mobile and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.