Adaptive Clock Generation Module for DVFS and Droop Response
Memory interface IP sector heats up
(06/24/2009 12:07 AM EDT)
SANTA CLARA, Calif. -- The current and ongoing downturn has taken a major toll on the semiconductor industry.
But one of the few exceptions to the rule is the semiconductor intellectual-property (IP) business--at least on some fronts. The memory interface IP sector, especially for DRAM, is heating up.
ARM, Denali, Synopsys, Virage and other memory interface IP vendors are now seeing an upswing in business, analysts said. The severe downturn is causing a growing number of OEMs to evaluate or rationalize their internal IP efforts, said Mark Gogolewski, chief technology officer of IP provider Denali Software Inc. (Sunnyvale, Calif.).
The cost of IP development is becoming expensive for OEMs. ''The investments for DRAM interface development have gone up,'' Gogolewski said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Virage Logic Expands Memory Interface Product Portfolio With New DDR3 Solution That Supports Speeds Up to 1.6 Gb/s
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver
- 4DS Unveils New Interface Switching ReRAM Technology for Faster and Energy Efficient Memory for AI Processing
- EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
Breaking News
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
- Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
- MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
Most Popular
- New Breakthroughs in China's RISC-V Chip Industry
- Cadence to Acquire Arm Artisan Foundation IP Business
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Shifting Sands in Silicon by Global Supply Chains