Virage Logic Joins Power.org Community; Provides Power Architecture Customers Extensive Range of Silicon-Proven Semiconductor IP
PISCATAWAY, NJ -- June 29, 2009 -- Power.org™, the organization that promotes and develops standards for Power Architecture® technology, today announced that Virage Logic Corporation (NASDAQ: VIRL), the semiconductor industry's trusted IP partner, has joined Power.org as a participant member. Virage Logic provides an extensive range of semiconductor IP that removes the traditional bottleneck in processor design -- access to embedded memories and silicon implementation -- speeding time-to-market and helping minimize design costs.
"The strength of a processor is dependent on its peripherals and with Virage Logic's production-proven, advanced interface IP solutions, PowerPC-based designs can leverage the critical IP required for successful SoC designs," said Power.org CTO, Kaveh Massoudian. "The company's technology and expertise will provide a valuable asset to the Power Architecture ecosystem, making Power Architecture technology available to the mass market and to the mainstream fabless semiconductor market."
Recently, Virage Logic announced an agreement with IBM designating the company as an IBM PowerPC Design Center, granting it the rights to license and distribute IBM's PowerPC® processor and peripheral cores when combined with Virage Logic's broad portfolio of semiconductor IP.
"Our participation in Power.org allows us to broaden the portfolio of highly differentiated silicon-proven IP available to the Power.org community," said Dr. Yankin Tanurhan, vice president and general manager, non-volatile memory (NVM) solutions, Virage Logic. "We look forward to working closely with members of the organization to drive innovation while helping them achieve their cost, performance and time-to-market goals."
About Virage Logic Corporation
Virage Logic Corporation (NASDAQ: VIRL) is a leading provider of semiconductor intellectual property (IP) for the design of complex integrated circuits. The company's highly differentiated product portfolio includes embedded SRAMs, embedded NVMs, embedded memory test and repair, logic libraries, memory development software, and interface IP solutions. As the industry's trusted semiconductor IP partner, foundries, IDMs and fabless customers rely on Virage Logic to achieve higher performance, lower power, higher density and optimal yield, as well as shorten time-to-market and time-to-volume. For further information, visit http://www.viragelogic.com.
About Power.org
Power Architecture technology is behind millions of innovative products, including the world's fastest supercomputers, leading video game consoles, and electronic systems in most of today's car models. Every phone call, email and Web page touches hundreds of Power Architecture systems.
The open Power.org community, formed in 2005, is the organization driving collaborative innovation around Power Architecture technology. Power.org's mission is to optimize interoperability, accelerate innovation and drive increased adoption of this leading processor architecture. For more details, visit www.power.org.
|
Related News
- GDA Technologies, Inc. Joins Power.org Community Strengthening the Power Architecture Roadmap and Enabling Power Architecture Solutions in Growth Market Areas
- Virage Logic Expands Semiconductor IP Portfolio with Silicon-Proven SiANA(TM) Analog IP Offering
- Virage Logic Introduces Ultra-Low-Power Semiconductor IP Platform, Allowing Up to 20X Reduction in Static, 80 Percent in Dynamic Power Dissipation
- ATI Technologies taps Virage Logic for silicon-proven embedded memories
- Virage Logic First to Provide Silicon-Proven IP on TSMC Nexsys 90-nm Process
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |