Dolphin Integration launches the BTF upgrade of its standard cell offering SESAME for 130 nm
Highly Dense and endowed with “Back-Tracking Freedom”, HD-BTF incorporates the latest architectural innovations from Dolphin Integration replacing classical flip-flops with their “spinner cell”.
Elsa Bernard-Moulin soberly commented that “this roll-out of innovations is going to be an on-going process as the field of Cell Libraries had become far too standard!”
The benefit of such innovations is a significant improvement in terms of density and power consumption compared with the previous stem release at 130 nm. HD-BTF is up to 20% denser and up to 60% less consuming in comparison with free contenders.
Targeting wireless, consumer and nomad applications, the HD-BTF stem enables more than cost reduction at SoC level as it also grants the fastest time-to-fab.
Skeptical standard cell users can gain access for downloading the freeware Motu Uta, from Dolphin Integration website, for an objective and fast benchmarking process of their current standard-cell libraries versus HD-BTF!
The 130 nm range of both Memories and standard cell libraries is being enriched with a cell stem dedicated to High Speed and the new sRAM Haumea targeting the Best mix for Consumption and Density (BCD).
The HD-BTF stem now is released in TSMC 180 / 130 / 65 nm.
For more information: http://www.design-reuse.com/sip/view.php?id=17363
Users can click on the link below to freely get access to the Motu Uta evaluation kit:
http://www.dolphin.fr/flip/sesame/benchmark/sesame_motuuta.php
Due to the diversity of foundries addressed, make sure to check the availability at other foundries and with various process shrinks.
About Dolphin Integration
Dolphin Integration is up to their charter as the most adaptive creator in Microelectronics to "enable mixed signal Systems-on-Chip", with a quality management stimulating reactivity for innovation. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, resilient to noise and drastic for low power-consumption, together with engineering assistance and product evolutions customized to their needs.
For more information about Dolphin, visit: www.dolphin.fr/sesame
|
Dolphin Semiconductor Hot IP
Related News
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration announce the availability of new ROM TITAN and ultra low leakage standard cell library SESAME BIV at TSMC 55 nm LP eFlash
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
- Dolphin Integration announces even denser 6-Track standard cells to decrease power consumption at 180/130 nm
- Dolphin Integration announce availability of their 6-Track Standard Cell Library SESAME HD for the 65 nm LP process
Breaking News
- NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
Most Popular
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- BrainChip Extends RISC-V Reach with Andes Technology Integration
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |