English
TSMC June 2009 Sales Report
Hsinchu, Taiwan, R.O.C. - July 10, 2009 - TSMC (TWSE: 2330, NYSE: TSM) today announced its net sales for June 2009: on an unconsolidated basis, sales were approximately NT$25.78 billion, an increase of 5.3 percent over May 2009 and a decrease of 9.6 percent from June 2008. Revenues for January through June 2009 totaled NT$109.56 billion, a decrease of 35.9 percent compared to the same period in 2008.
On a consolidated basis, net sales for June 2009 were approximately NT$ 26.52 billion, an increase of 5.0 percent over May 2009 and a decrease of 10.0 percent from June 2008. Revenues for January through June 2009 totaled NT$113.71 billion, a decrease of 35.3 percent compared to the same period in 2008.
On a consolidated basis, net sales for June 2009 were approximately NT$ 26.52 billion, an increase of 5.0 percent over May 2009 and a decrease of 10.0 percent from June 2008. Revenues for January through June 2009 totaled NT$113.71 billion, a decrease of 35.3 percent compared to the same period in 2008.
|
||||||
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |