Xentec Introduces IP Cores : 2-D Wavelet, ATAPI-4 and I 2 C cores to increase market exposure to multimedia applications.
Xentec Introduces IP Cores : 2-D Wavelet, ATAPI-4 and I 2 C cores to increase market exposure to multimedia applications.
Oakville, Ontario -- March 22, 1999 -- Xentec, Inc. introduced three new cores at IP99. They include a 2-D Wavelet Compression, an ATAPI-4 and I 2 C cores.
The 2-D Wavelet core (X_2DWAV) is a natural extension of Xentec's offerings to the multimedia line of cores that already include DCT/IDCT, JPEG encoder/Decoder etc.
The X_ATAPI4 is an interface between the host and storage devices implementing the AT Attachment with Packet Interface (ATAPI-4) standard. The ATAPI-4 interface is backward compatible with previous generations of AT Attachment standards. ATAPI-4 supports sustained burst DMA transfers of up to 16Mbits/s. Typical applications for the X_ATAPI4 core include personal computer (PC) hard disks, CD-ROMs and other mass
storage devices.
The X_I 2 C_Master and X_I 2 C_Slave cores are an I 2 C Master and I 2 C Slave controller synthesizable cores offered in VHDL and Verilog. These cores are designed for a wide range of applications, which require a cost-effective serial communications channel.
About Xentec
Xentec, Inc. provides comprehensive ASIC design services, integration expertise, and technology for the product development requirements of the world's leading
electronics companies. Founded in 1995, Xentec's mission is to be the leading provider of analog/digital integrated circuit design services and Intellectual Property
used in System-on-Chip (SoC) based integrated circuits for all facets of the electronics industry. The company is headquartered in Oakville, Ontario and is
privately funded. More information about the company, its products, and services may be obtained from the World Wide Web at www.xentec-inc.com.
For inquiries regarding Xentec cores and services please contact sales@xentec-inc.com
Xentec Incorporated
300-2908 South Sheridan Way
Oakville, ON L6J 7J8
Phone (905)829-8889
Fax (905)829-0888
Related News
- Tensilica Ports MPEG-4 BSAC Decoder for Digital Multimedia Broadcasting (DMB) to HiFi 2 Audio Engine
- LSI Logic Expands DSP Multimedia Capabilities to Support Projected $1.4 Billion Market
- Mobilic Introduces New Multimedia SoC Processor Family; Mobilic Makes Strong Entry Into the Mobile Video Market With SoC Products That Feature the Industry's Highest Level of Functional Integration
- Cypress Introduces Next Generation Of 2.4-GHz WirelessUSB(TM) Radio-on-a-Chip With Low Power Consumption
- Cypress Introduces Industry's First 2.4-GHz Radio-on-a-Chip With Programmable Mixed Signal Array
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |