The business of IP: it ain't a bake sale
edadesignline.com (July 22, 2009)
IP vendors have long maintained that theirs is a product business model. In the face of rising complexity and shrinking geometries, however, selling IP may no longer be about baking up a plate of brownies, sealing it in shrink wrap, and putting it out there for sale.
IP is about creating a core of some sort, finding someone who needs the approximate features of that core, and then working closely with the customer to tune, tamper, and tweak it, until it fits exactly into a design. That requires services, and services are never shrink-wrapped.
The IP business model is not just about products today; it's a hybrid of product and services. But for every IP vendor who admits to the hybrid model, there's a baker's dozen out there who still swear they only do products, with just a dollop of service thrown in for good measure. Do these guys need to wake up and smell the baking powder?
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- USB Ain't So Simple Anymore
- Viewpoint: Don't believe the patent sale hype
- NanoXplore acquires Dolphin Design's ASIC business and strengthens its strategic position in aerospace
- CEO Interview: Sameer Wasson of MIPS -- "Have a Steady Hand, Don't be Distracted"
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset