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TSMC and Global Unichip Collaborate On Silicon Proven SiP Solution in TSMC Reference Flow 10.0
The SiP Flow help designers ensure component design success with accurate and systematic analysis of inter-die and package effects
Hsinchu, Taiwan -- July. 27, 2009 -- Global Unichip Corp. (GUC; TW: 3443), the world’s leading Design Foundry service provider, announced today the application and validation of System-in-Package (SiP) design solution in TSMC Reference Flow 10.0 as the fruit of collaboration with TSMC. The SiP methodology has been fully qualified with GUC production case and achieved good silicon correlation.
The SiP Flow provides die-to-package co-design with comprehensive SiP design analysis such as component timing, IR drop, signal-integrity/simultaneous switching noise, and thermal analysis. The SiP flow also offers die-to-package DRC/LVS verification solutions and electrical, physical design guideline. The SiP timing has been correlated to silicon data with high accuracy.
“TSMC Reference Flow 10.0 enables designers to effectively use package design capability to deliver a more competitive component. ” said ST Juang, Senior Director of Design Infrastructure Marketing at TSMC. “The integrated design approach reduces extra design margins used in modeling package effects, so customers can design their SiPs more systematically and ensure first time success for their product.”
Jim Lai, president and COO of GUC also said, “We offer customers more design analysis and capability that include multiple die and package effects. This joint effort between TSMC and GUC also demonstrates our design leadership and differentiation from competitor’s solution by showing robust SiP design capability, ensuring component success, not just die success.”
TSMC and GUC have been collaborating to provide the best and most advanced design solution to our end customers, in both SoC and SiP. This TSMC Reference Flow 10.0 SiP flow offers a complete end-to-end solution to extend the service from SoC to SiP. It not only creates customer value but also provides a lowest risk path for customer’s next project.
About Global Unichip Corp.
Global Unichip Corp. (GUC), a dedicated fabless ASIC provider based in Taiwan, was founded in 1998. GUC is now publicly traded on the Taiwan Stock Exchange under the symbol 3443 with 2008 revenue of 295MUSD. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC and SiP turnkey services. GUC is committed to providing the most advanced and best price-performance silicon solutions through close partnership with TSMC, GUC’s major shareholder, and other key packaging and testing powerhouses. With state of the art EDA tools, advanced methodologies, and experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC has established a global customer base throughout Greater China, Japan, Korea, North America, and Europe. Its track record in complex SoC/SiP designs has brought benefits to customers in time to revenue at the lowest risk. For more information, please visit http://www.globalunichip.com
Hsinchu, Taiwan -- July. 27, 2009 -- Global Unichip Corp. (GUC; TW: 3443), the world’s leading Design Foundry service provider, announced today the application and validation of System-in-Package (SiP) design solution in TSMC Reference Flow 10.0 as the fruit of collaboration with TSMC. The SiP methodology has been fully qualified with GUC production case and achieved good silicon correlation.
The SiP Flow provides die-to-package co-design with comprehensive SiP design analysis such as component timing, IR drop, signal-integrity/simultaneous switching noise, and thermal analysis. The SiP flow also offers die-to-package DRC/LVS verification solutions and electrical, physical design guideline. The SiP timing has been correlated to silicon data with high accuracy.
“TSMC Reference Flow 10.0 enables designers to effectively use package design capability to deliver a more competitive component. ” said ST Juang, Senior Director of Design Infrastructure Marketing at TSMC. “The integrated design approach reduces extra design margins used in modeling package effects, so customers can design their SiPs more systematically and ensure first time success for their product.”
Jim Lai, president and COO of GUC also said, “We offer customers more design analysis and capability that include multiple die and package effects. This joint effort between TSMC and GUC also demonstrates our design leadership and differentiation from competitor’s solution by showing robust SiP design capability, ensuring component success, not just die success.”
TSMC and GUC have been collaborating to provide the best and most advanced design solution to our end customers, in both SoC and SiP. This TSMC Reference Flow 10.0 SiP flow offers a complete end-to-end solution to extend the service from SoC to SiP. It not only creates customer value but also provides a lowest risk path for customer’s next project.
About Global Unichip Corp.
Global Unichip Corp. (GUC), a dedicated fabless ASIC provider based in Taiwan, was founded in 1998. GUC is now publicly traded on the Taiwan Stock Exchange under the symbol 3443 with 2008 revenue of 295MUSD. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC and SiP turnkey services. GUC is committed to providing the most advanced and best price-performance silicon solutions through close partnership with TSMC, GUC’s major shareholder, and other key packaging and testing powerhouses. With state of the art EDA tools, advanced methodologies, and experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC has established a global customer base throughout Greater China, Japan, Korea, North America, and Europe. Its track record in complex SoC/SiP designs has brought benefits to customers in time to revenue at the lowest risk. For more information, please visit http://www.globalunichip.com
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