TSMC keynoter touts cooperative business models
(07/29/2009 2:51 AM EDT)
SAN FRANCISCO -- Future growth in EDA and other segments of the semiconductor industry supply chain depends on the evolution of a new breed of collaborative business model that enable partners to pool costs and increase profits, according to Fu-Chieh Hsu, vice president of Design & Technology Platform at leading foundry Taiwan Semiconductor Manufacturing Co. (TSMC).
Delivering a keynote address at the Design Automation Conference here Tuesday (July 28), Hsu said a community business model with tight partnerships could enable TSMC and ecosystem partners to collectively create greater value and get better returns by collaborating to reduce waste, development costs and maintenance overhead.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- SiFive Awarded TSMC Open Innovation Platform Partner of the Year
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity