Innodul AG selects Rad3's advanced FEC IP for its Plastic Optical Fiber products
Calgary, Canada –September 14, 2009 – RAD3 Communications Inc. (RAD3), a communications intellectual property (IP) company, today announced that Innodul AG, a Swiss supplier of Plastic Optical Fiber (POF) products, has chosen RAD3’s advanced Forward Error Correction (FEC) solutions for its POF product line.
Innodul licensed RAD3’s advanced FEC solutions for inclusion in its line of enterprise, industrial, home and automotive POF products. Due to its simplicity POF can carry Ethernet, USB, IEEE1394 and other protocols and is very robust against vibration, EMI, EMC, humidity, and has a wide temperature range. Innodul required a robust and high-data rate FEC solution for its products and chose RAD3, a proven provider of advanced FEC solutions for the communications industry.
“We evaluated a large number of IP companies and RAD3 came out on top.” said Guido Willi, President Innodul. “RAD3’s knowledge of Forward Error Correction technologies and their ability to support both FPGA and ASIC operation at high clock speeds made them the leading candidate. In addition, the level and quality of support provided by Rad3 was excellent and allowed us to rapidly integrate their IP into our products. We look forward to working with them on future projects.”
Commenting on RAD3's success at Innodul, Roger Bertschmann, President at RAD3, said "We are very pleased to have enabled Innodul to get to market quicker with its POF products through the rapid and successful deployment of our leading edge FEC IP and we look forward to extending our working relationship further for their next phase of product developments".
About RAD3 Communications Inc.
RAD3 is a leading supplier of communications intellectual property (IP) for new and emerging wired and wireless communication standards. RAD3’s extensive library of IP solutions enables communication companies to rapidly design and build their products using a suite of industry proven IP. For more information, please visit RAD3’s web site: www.rad3comm.com.
About Innodul AG.
Innodul is a Swiss based company focused on developing POF solutions for the enterprise, industrial, home and automotive markets. The company is registered in Switzerlandand is funded by Microdul Holding (www.microdul.com) and the founders. It is a spin-out of former Philips Semiconductors/NXP and has a team of entrepreneurial business executives, researchers and scientists. For more information, please visit the Innodul’s web site: www.innodul.com.
|
Related News
- Synopsys' IC Validator Adopted by Plastic Logic for Physical Verification of Advanced Displays
- Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects
- M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |