ICE-IP-338 High-speed XTS-GCM Multi Stream Inline Cipher Engine
Fast interfaces overlap at IDF
USB3 and its optical replacement both get real in 2010
Rick Merritt, EETimes
(09/24/2009 5:15 PM EDT)
SAN FRANCISCO, Calif. — The buzz in fast interconnects at the Intel Developer Forum was supposed to be around SuperSpeed USB, the 3.0 version of the omnipresent interface coming to systems in 2010. But somewhere on the road to San Francisco's Moscone Center, Intel decided to roll out Light Peak, the next next big thing in fast interconnects.
The 5 GHz USB 3.0 still got plenty of attention with a dozen chip, system and software vendors showing working products with throughput up to 250 Mbytes/second. But the 10 Gbit/second optical Light Peak captured people's imaginations—especially when Intel said it would have discrete controllers for it in 2010, perhaps even before it supports USB 3.0 in its chip sets.
E-mail This Article | Printer-Friendly Page |
Related News
- Light Peak panned by OEM, report
- For notebooks, Light Peak is in, USB 3.0 is out? Join the conversation
- SuperSpeed USB-Enabled Device Shipments on Fast Track to 1 Billion in 2014
- USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing
- TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
Breaking News
- Alphawave Semi Q4 2024 Trading and Business Update
- ST-GloFo fab plan shelved
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets