Dolphin Integration announces the availability of assessment result of its High Density stem for benchmarking purposes
Meylan, France -- September 28th, 2009 -- Three months ago, Dolphin Integration offered as a public the first Standard Evaluation Circuit, referred to as Motu Uta, a representative logic design for benchmarking Standard Cell libraries.
Dolphin Integration is announcing the availability of the first assessment results on this Motu Uta logic standard: diverse users indeed are in a position to compare the worth of traditional “free” complex libraries with the celebrated SESAME.
Of course the short-cut comparison of NAND2 gates, could not be of any relevance while the most significant cells are those implementing flip-flops!
The High Density stem HD-BTF for the TSMC 180 nm G process is now released with the benefit of Back-tracking Freedom. It enables predictable and faster Placement and Routing for the shortest Time-to-Fab targeting consumer and nomad applications.
With the availability of assessment results on Motu Uta for this HD-BTF stem, standard cell users can speed-up their library selection for the HD-BTF stem versus contenders by relying on an objective benchmarking process!
Prospective users only need to click on the link to Dolphin Integration website to freely get access to the evaluation kit: it holds one tutorial, one RTL code, and benchmarking context proposals at
http://www.dolphin.fr/flip/sesame/benchmark/sesame_motuuta.php
Those users who have proven through their results their mastery of the complex optimization settings all along the flow from Synthesis, through Placement, Routing and Timing Analysis, deserve and receive a memorable Diploma of Achievement.
About Dolphin Integration
Dolphin Integration is up to their charter as the most adaptive creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation and Foundry independence. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, resilient to noise and drastic for low power-consumption, together with engineering assistance and product evolutions customized to their needs.
For more information about Dolphin, visit: www.dolphin.fr/sesame
|
Dolphin Design Hot IP
Related News
- Amazing improvement of power and density for RFID chips with standard cell libraries at 180 nm from Dolphin Integration
- Try and adopt Motu-Uta, the benchmark from Dolphin Integration for a fair evaluation of Standard Cell libraries
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
- Dolphin Integration enables 1P3M/1P4M SoC designs at 180 nm with their ultra high density standard cell library
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |