D&R Headline News (Last 14 Days)

Headlines for Friday Dec. 20, 2024

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Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Enabling the Industry’s First 64 Gbps UCIe IPs following the Successful Tapeout of Alphawave Semi’s Gen2 36 Gbps UCIe IP on TSMC’s 3nm Technology, supporting both High-Yield, Low-Cost Organic Substrate Standard Packaging and Advanced Packaging Technologies.

• Jury is out in the Arm vs Qualcomm trial
• Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition

Headlines for Thursday Dec. 19, 2024

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Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance

Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces valuable enhancements to the DVB-S2X IP core portfolio, specifically the M400 and M800 models.

• RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
• Third day for Arm vs Qualcomm trial
• VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series

Headlines for Wednesday Dec. 18, 2024

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Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block

Crypto Quantique, a provider of quantum-driven security for the Internet of Things (IoT), has boosted the functionality of its semiconductor hardware security IP block, QDID, adding a true random number generator (TRNG) to the physical unclonable function (PUF).

• ARM versus Qualcomm court case opens
• Reimagining Video Excellence at CES 2025 with intoPIX
• Andes Technology Partners with ProvenRun to Strengthen RISC-V Trusted Execution Environment

Headlines for Tuesday Dec. 17, 2024

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sureCore teams with Sarcina to package cryo chips

Further to sureCore’s recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, the company has revealed that it has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic temperatures.

• QuickLogic Announces Appointment of Andy Jaros as Vice President of IP Sales
• Synopsys and SiMa.ai Announce Strategic Collaboration to Accelerate Development of Automotive Edge AI Solutions
• BrainChip Awarded Air Force Research Laboratory Radar Development Contract
• Dolphin Semiconductor transfers HQ to Canada
• M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development

Headlines for Monday Dec. 16, 2024

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Frontgrade Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications

As part of the ESA-backed “EEE Space Component Sovereignty for Europe” program, Frontgrade Gaisler is collaborating with key industry leaders such as imec (Interuniversity Microelectronics Centre vzw) and IMST GmbH, to leverage their collective expertise in high-performance microprocessors, advanced semiconductor libraries, and high-speed memory interfaces.

• Frontgrade Gaisler Licenses BrainChip's Akida IP to Deploy AI Chips into Space
• Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles
• Industry Grade ASIL-B IP Cores licensed to Power Next-Gen Automotive Systems

Headlines for Thursday Dec. 12, 2024

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BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC

BOS Semiconductors, the Korean automotive fabless company, and Tenstorrent, an AI design company, are pleased to announce the first debut of industry’s first automotive AI accelerator chiplet SoC, Eagle-N, jointly developed by BOS and Tenstorrent.

• Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
• Powering the NVM and Embedded Chip Security Technologies
• BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform

Headlines for Wednesday Dec. 11, 2024

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Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters

Synopsys today announced the industry's first Ultra Ethernet IP and UALink IP solutions, including controllers, PHYs, and verification IP, to meet the demand for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnects.

• Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
• Quobly announces key milestone for fault-tolerant quantum computing
• CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
• Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
• MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC
• PIMIC Unveils Business Strategy, and Silicon Technology to Revolutionize AI at the Edge

Headlines for Tuesday Dec. 10, 2024

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Crypto Quantique upgrades QuarkLink IoT device security platform for post-quantum cryptography (PQC)

Crypto Quantique, a provider of quantum-driven security for the Internet of Things (IoT), has upgraded its QuarkLink IoT device security platform with a hybrid post-quantum cryptographic algorithm.

• Rambus and Micron Technology Extend Patent License Agreement
• TSMC November 2024 Revenue Report
• Micon Global Selected as Sales Representative for Blue Cheetah Analog Design
• Comprehensive ADC/DAC and AFE IP Solutions: Enabling Next-Generation Applications Across Varying Technology Nodes

Headlines for Monday Dec. 09, 2024

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Arasan Announces immediate availability of its SPMI IP (System Power Management Interface)

Arasan expands its MIPI IP portfolio with the announcement of the immediate availability of its SPMI IP (System Power Management Interface) compliant to MIPI SPMI Specificationv2.0.

• SiFive Empowers AI at Scale with RISC-V Innovation
• UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application
• Sondrel now shipping chips as part of a complete turnkey project
• Avant Technology Appointed as Sales Representative in Asia for EnSilica's eSi-Crypto IP

Headlines for Friday Dec. 06, 2024

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Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU

Qualitas Semiconductor announced that its MIPI D-PHY IP has been integrated into an artificial intelligence (AI) and vision processing microprocessor (MPU) developed by Renesas Electronics. The relationship between Qualitas and Renesas began in 2021, when they started collaborating on multiple successful projects.

• CXL Consortium Announces Compute Express Link 3.2 Specification Release
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
• Alphawave IP - Announcement regarding leadership transition
• Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024

Headlines for Thursday Dec. 05, 2024

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YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets

YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution. Currently advanced packaging is too expensive and unsuitable for mass market applications as packaging costs can easily exceed silicon costs.

• GUC Monthly Sales Report - November 2024
• Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce
• Ceva-NeuPro-Nano Wins Product of the Year Award at Prestigious EE Awards Asia Event
• UMC Reports Sales for November 2024
• IP players prominent in chiplet's 2024 diary