Magma Announces Renewed Credit Line, Improved Terms
SAN JOSE, Calif. -- Oct. 19, 2009 -- Magma(R) Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, announced today it has renewed a credit line with Wells Fargo Bank. The new line replaces an existing $15 million credit facility, eliminates borrowing restrictions imposed by the prior facility and extends the term of the agreement.
"This new line of credit's favorable terms give us improved flexibility, and I believe indicate improved confidence in Magma's financial profile," said Magma Chief Financial Officer Peter S. Teshima. "Wells Fargo has been an excellent financial partner since 2003 and we are very pleased to continue this relationship."
Magma entered into an amendment to an existing credit agreement between Magma and Wells Fargo Bank on Oct. 9, 2009, resulting in a single revolving line of credit of $15 million that replaced two previous $7.5 million revolving lines of credit. It also eliminated borrowing restrictions based on Magma's level of accounts receivable and extended the term of the line of credit to Sept. 30, 2010. The line of credit was initiated in 2007.
About Magma
Magma's electronic design automation (EDA) software is used to create complex, high-performance integrated circuits (ICs) for cellular telephones, electronic games, WiFi, MP3 players, DVD/digital video, networking, automotive electronics and other electronic applications. Magma products for IC implementation, analog/mixed-signal design, analysis, physical verification, circuit simulation and characterization are recognized as embodying the best in semiconductor technology, providing the world's top chip companies the "Fastest Path to Silicon"(TM). Magma maintains headquarters in San Jose, Calif., and offices throughout North America, Europe, Japan, Asia and India. Magma's stock trades on Nasdaq under the ticker symbol LAVA. Visit Magma Design Automation on the Web at www.magma-da.com.
|
Related News
- Magma Announces Quartz iPOP Initiative -- Delivers "Improved Productivity, Operability and Performance" for Faster, Higher Capacity Physical Verification
- Magma Realigns Organization for Enhanced Focus On Key Technology Segments and Improved Financial Profile
- CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
- Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line
- CAST Adds New SafeSPI Controller to its Functional Safety IP Core Product Line
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |