Wireless expert Edgar Auslander Appointed Head of ST-Ericsson's Strategic Planning
November 04, 2009 -- ST-Ericsson, a world leader in wireless platforms and semiconductors, announces that Edgar Auslander has been appointed Senior Vice President, head of Strategic Planning. He brings more than 20 years of experience in wireless communications and semiconductors.
“Edgar’s impressive credentials will be key in helping us devise the best strategies that will contribute to our continued innovation and business leadership,” said Gilles Delfassy, President and CEO of ST-Ericsson. “I’m confident that ST-Ericsson will benefit from his business savvy and deep industry knowledge, while we are shaping the long-term success of the company.”
Auslander was one of the founders of Texas Instruments' Wireless Business Unit, which he contributed to transform in less than eight years to a global leader. He also served as its General Manager, Worldwide Strategy and Corporate Development.
Prior to joining ST-Ericsson, Auslander was Director, Ultra Mobility Group at Intel, responsible for the integration and support of wireless platforms for mobile internet devices and strategic alliances. Between 2006 and 2007 he was a Vice President at a venture capital firm in California.
From 2001 to 2004, as Senior Vice President, Marketing and Strategy, Auslander helped to launch a Silicon Valley start-up, supplying major mobile operators and phone manufacturers with mobile devices and integrated software solutions. He was also on the Board of Advisors of several start-ups.
Co-author of "The Applications of Programmable DSPs in Mobile Communications" (Wiley), Auslander holds an MBA from Columbia University and a Master of Electrical Engineering from Cornell University. He is also a senior member of the IEEE.
About ST-Ericsson
ST-Ericsson is a world leader in developing and delivering a complete portfolio of innovative mobile platforms and cutting-edge wireless semiconductor solutions across the broad spectrum of mobile technologies. The company is a leading supplier to the top handset manufacturers and ST-Ericsson’s products and technologies enable more than half of all phones in use today. The company generated pro-forma sales of about $3.6 billion in 2008. ST-Ericsson was established as a 50/50 joint venture by STMicroelectronics (NYSE:STM) and Ericsson (NASDAQ:ERIC) in February 2009, with headquarters in Geneva, Switzerland.
|
Related News
- Ericsson's JV ST-Ericsson announces new strategic direction
- Ceva and India's No. 1 Audio and Wearable Brand, boAt, Announce Strategic Partnership to Enhance the Wireless Audio Experience
- Ericsson and STMicroelectronics agree on strategic way forward for ST-Ericsson
- ST-Ericsson opens the way for a new era of smartphones and announces the world's fastest, coolest integrated LTE Modem and Application Processor platform based on FD-SOI
- ST-Ericsson confirms strategic direction
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |