SiliconBlue Technologies is the First New FPGA Company to Ship in Production Volume in 20 Years
Update: Lattice Semiconductor to Acquire SiliconBlue (Dec 09, 2011)
- Over 10 Customers Shipping Consumer Products Using mobileFPGAs in Volume
- Industry’s First and Only True Wafer Level Chip Scale FPGA Package Solution Accelerates Adoption
SANTA CLARA, Calif.-- December 1, 2009 --SiliconBlue® Technologies, a leader in ultra-low power, single-chip, SRAM FPGAs, today announced that it has shipped production-volume quantities of its iCE65™ mobileFPGA™ devices to more than 10 customers. This makes SiliconBlue Technologies the first new programmable logic solutions company in over 20 years to achieve this milestone. The achievement comes as the market for highly-integrated, extremely-low power mobile applications such as feature phones, eBook readers, MIDs (mobile internet devices), and DSCs (digital still cameras) has begun explosive growth.
“As we move through the design-in process with customers, it’s apparent that our mobileFPGA devices are providing the right solution at the right time,” said Kapil Shankar, CEO of SiliconBlue. “Much as the growth of traditional FPGAs was driven by the telecom boom of the 1990’s, the growth of mobileFPGA devices is being driven by the rate of innovation in today’s exploding mobile consumer market.”
The rapid adoption of SiliconBlue’s mobileFPGA family is based on its unmatched ability to meet consumers demand for converging functions on portable battery-operated devices. It is often difficult for hardware designers of products like feature phones and eBooks to meet this demand because of the constrained space, power and cost requirements they face. In addition, the various semiconductor products that they use are not necessarily designed to work together. By offering high capacity, low power, small packages, and ASIC-like prices, the iCE65 mobileFPGA family delivers the time-to-market benefit of programmable logic solutions to a new and emerging market. They are enabling the creation of seamless new solutions.
Built on TSMC’s standard 65nm low-power CMOS process, SiliconBlue’s iCE65 devices are single-chip, reconfigurable, SRAM-based devices that incorporate the company’s proprietary NVCM (Non-Volatile Configuration Memory) technology. NVCM eliminates the need for an external flash PROM, making them a true ASIC alternative. Devices are available in the most advanced small-form-factor packaging, including the industry’s first and only Wafer Level Chip Scale Package (WLCSP). SiliconBlue’s complete design environment includes the iCEcube™ VHDL and Verilog-based development software, and the iCEman™ evaluation kit. In addition, the company works closely with its supply partners to meet the highest levels of product quality and production readiness.
About SiliconBlue
SiliconBlue Technologies provides a new class of ultra-low power, single-chip, SRAM FPGAs designed specifically for handheld consumer applications. Manufactured on TSMC’s 65nm LP (low power) CMOS process, the iCE65 mobileFPGA family meets the capacity, power, area, and price requirements for battery-operated products such as Smartphones, eBooks/ePaper, netbooks, mobile internet devices, portable media players, handheld POS terminals, medical instruments, digital still cameras and flash camcorders. Headquartered in Santa Clara, California, the company has a highly skilled team of PLD experts who have been instrumental in developing and patenting many of the leading programmable logic technologies on the market today.
|
Related News
- SiliconBlue Announces Volume Production Shipments of its iCE65 Ultra-Low Power FPGAs
- Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment
- Xylon Celebrates 20 Years of FPGA Excellence
- Xilinx and TSMC Reach Volume Production on all 28nm CoWoS-based All Programmable 3D IC Families
- DediProg Now Offers Volume Production Programming Solution for SiliconBlue's Custom Mobile Devices
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |