Infineon Reaches Agreement to Settle Legal Dispute with Fairchild
Neubiberg, Germany – December 28, 2009 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has settled a patent infringement lawsuit with Fairchild Semiconductor. Infineon initiated the lawsuit in November 2008 in the U.S. District Court for the District of Delaware. The patents in the suit and counter suit consisted of fourteen patents related to super-junction power transistors along with trench power MOSFETs and IGBT power transistors.
The lawsuit has been settled through a broad patent cross license relating to semiconductor technology. As part of the agreement, Fairchild will make payments to Infineon. The specific terms and conditions of the agreement are confidential.
Infineon and Fairchild will inform the U.S. District Court, District of Delaware, that they had reached a settlement and will file a stipulation of dismissal. Infineon, a global leader in the semiconductor industry, is currently in patent licensing discussions with a number of semiconductor companies. Infineon views such discussions as essential to the continuing protection of its intellectual property and business interests.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
|
Related News
- Infineon and Atmel Reach Agreement to Settle Patent Dispute
- Innovium and Broadcom Settle Legal Dispute
- Fujitsu Microelectronics and Nanya Technology Sign License Agreement to Settle Patent Dispute
- Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers
- Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |