eASIC Slashes Power with Low Voltage Devices
New Devices Reduce Power Consumption up to 40%
Santa Clara, CA – January 22, 2010 – eASIC Corporation, today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption. The new 1.0V device options are optimized for applications that require low cost and low power such as smart meters, portable projectors, toys, and handheld medical devices.
eASIC’s Nextreme family is an excellent alternative to standard cell ASIC designs as it provides significantly lower up-front development cost and risk. In addition, eASIC Nextreme provides a lower cost and lower power solution to costly and power hungry FPGAs. The addition of 1.0V device options now enhance the designer’s ability to meet ever shrinking power budgets, achieve longer battery life of their equipment by reducing both static and dynamic power consumption.
“The design wins we are having with these 1.0V devices are giving our customers a market advantage through benefiting from both low cost and low power,” said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC Corporation. “We are particularly seeing increased adoption in high volume, hand-held, battery operated applications where we have traditionally not focused,” added Bhoot.
The NX750LP and NX750 low core voltage device options are ideal for designs that require up to 55K Logic Cells (approximately 750K Gates). These devices are available as part of the low cost ASIC-in-a-Box design kits that enable designs to be implemented in as little as 4 weeks.
Pricing and Availability
The 1.0V Nextreme Devices are available now from eASIC. Pricing starts at $3.95 in high volume. Learn more at www.easic.com.
About eASIC
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com
|
Related News
- LTRIM's LTR1010 Low Dropout Voltage Regulator Lowers Power Consumption, Increases Battery Life of Portable Devices
- Surecore's Low Power Memory Delivers Improved Power Efficiency For BLE-Enabled Devices
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
- JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
- Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |