ASIC pioneer reinvents 3-D FPGAs
R. Colin Johnson, EE Times
(01/29/2010 3:35 PM EST)
PORTLAND, Ore.—Serial entrepreneur Zvi Or-Bach is touting a three-dimensional field-programmable gate array (FPGA) technology that he claims could achieve the densities of an application specific integrated circuit (ASIC). Or-Bach's new company, NuPGA, presented details about its 3-D FPGA technology Friday (Jan. 29) at the Applied Materials Technical Symposium on 3-D Interconnect in Santa Clara, Calif.
Or-Bach, a past winner of the EE Times Innovator of the Year Award, previously pioneered ASICs at eASIC and later at Chip Express. Last year, Or-Bach applied for a patent with Rice University on a graphite-based memory process for creating reprogrammable memory elements, which NuPGA is now using as anti-fuses for its 3D FPGAs.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
Most Popular
- Arm's power play will backfire
- Siemens strengthens leadership in industrial software and AI with acquisition of Altair Engineering
- Sondrel announces CEO transition to lead next phase of growth
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available