Multi-Video-Source Multiplexing Serial Video Transmitter for MIPI CSI2
Black Sand Announces Acquisition of CMOS PA Intellectual Property
Advances CMOS PA Leadership Through Patent Portfolio Acquisition
AUSTIN, Texas -- February 02, 2010 -- Black Sand Technologies, Inc., a specialist in advanced power amplifier technology for wireless applications, today announced that it previously acquired a patent portfolio related to CMOS power amplifiers (PAs) from Silicon Laboratories.
According to the terms of the transaction, Black Sand received a number of issued and pending patents from Silicon Laboratories. The U.S. and international patents include claims and methods related to power amplifier architectures and implementations that can be used in a CMOS process.
In September, Black Sand announced the world’s first 3G CMOS RF PA. Black Sand’s proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices.
“The acquired IP represents important technology for Black Sand, significantly advancing our position as the leader in this field,” said John Diehl, CEO of Black Sand. “When combined with our internally developed IP, these foundational patents give us a unique combination of outstanding technology and substantial IP.” Detailed terms of the agreement were not disclosed.
Black Sand’s RF PA products are targeted at mobile phones and other 3G wireless devices, such as datacards and netbooks. Mobile phones and wireless products today use power amplifiers based on Gallium Arsenide (GaAs) semiconductor technology. Replacing GaAs with CMOS improves manufacturing yield, performance, cost, battery life, and call quality.
|
Related News
- ArterisIP Acquires iNoCs Software and Associated Intellectual Property Rights
- Javelin Semiconductor chooses Kilopass Non Volatile Memory Intellectual Property Core for MIPI RFFE Digital Interface in Next-Generation CMOS Power Amplifiers
- BiTMICRO Acquires QualCore's Intellectual Property
- Entropic Communications Selected to Acquire Trident Set-Top Box System-on-a-Chip Assets and Intellectual Property
- Silicon Image Completes Acquisition of Product Lines and Intellectual Property from Anchor Bay Technologies
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |