STMicroelectronics Announces World's First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers
Leading-edge embedded Flash process technology extended at Crolles 300mm wafer facility for next generation of advanced automotive chips
GENEVA, Feb. 22, 2010 -- STMicroelectronics, a top semiconductor supplier to the automotive industry, today announced its 55 nanometer (nm) embedded Flash (eFlash) process technology, which will be implemented in its next-generation automotive microcontroller (MCU) chips. ST is extending its production of eFlash technology to this advanced process node at its world-class 300mm manufacturing facility at Crolles, France.
The 55nm eFlash technology builds upon ST's 20-year expertise in embedded Flash and is also the continuation of the company's successful 90nm eFlash automotive microcontroller family. Automotive market demands are driving the technology beyond the performance currently delivered by 90nm-based chips. Next-generation automotive systems will increasingly require MCUs with more computational performance, better power efficiency and greater memory content to meet market requirements in automotive applications, such as functional safety, tougher emission standards or ADAS (Advanced Driver-Assistance Systems) solutions. The new technology will enable ST to provide substantial performance improvement and greater value to its customers and will be the basis for ST's future Automotive 32-bit Power Architecture™-based MCU roadmap.
ST's eFlash technology has been developed, and also will be manufactured, at the company's Crolles facility, which is automotive certified and is the world's leading manufacturing site for 55nm eFlash. Same-site development and manufacturing means ST can deliver high process stability and exceptionally high levels of quality, in addition to long-term availability. At Crolles, ST is in production with 55nm technology for automotive products and has already produced several fully working embedded Flash technology test vehicles implementing key automotive system IP.
"Embedded Flash is an absolutely critical technology in a chip maker's arsenal to deliver cutting-edge System-on-Chip ICs for automotive applications," said Marco Monti, General Manager of ST's Automotive Electronics Division. "Both the development and manufacturing at our Crolles site will ensure the high quality and adequate supply for our automotive customers."
ST's first MCU products to implement the 55nm eFlash technology are expected to target automotive applications, including engine management and transmission, car body controllers and safety/ADAS. First 55nm embedded-Flash product is expected to be available for customer sampling in mid-2011, and automotive qualification in 2013.
About STMicroelectronics
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the Company's net revenues were $8.51 billion. Further information on ST can be found at www.st.com.
|
Related News
- M31 Technology Develops SRAM Compiler IP on TSMC's 28nm Embedded Flash Process Technology Providing High Performance and Low Power Solutions
- SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform
- Toshiba Launches ARM Cortex-M3-based Microcontrollers with Latest 65nm Flash Embedded Logic Process for Motor Control and Consumer Devices
- Renesas Electronics Develops Industry's First 28nm Embedded Flash Memory Technology for Microcontrollers
- Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |