MIPS Technologies Names Ravikrishna Cherukuri Vice President of Engineering
Industry Veteran to Drive Development of Integrated Hardware/Software Solutions
SUNNYVALE, Calif. - March 30, 2010 - MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, today announced that it has named Ravikrishna Cherukuri vice president of engineering. Mr. Cherukuri is responsible for all of the company's hardware and software engineering efforts. Mr. Cherukuri has a deep background in microprocessors and software solutions with companies including AMD, Nexgen Microsystem, Siara Systems and Sonoa Systems.
"We are delighted to welcome Ravi to the company to lead our engineering efforts as we increase our focus on building tightly integrated hardware and software solutions," said Sandeep Vij, president and CEO, MIPS Technologies. "Ravi's expertise in microprocessor architectures, networking, cloud services infrastructure and system development will be a great benefit to MIPS Technologies and to our customers as they design the next generation of connected products."
"I have long been familiar with the elegance, simplicity and power of the MIPS® architecture," said Mr. Cherukuri. "I am looking forward to working with MIPS Technologies' hardware and software engineering teams who have long proven their ability to deliver high-performance, power efficient products. It is an exciting time to join the company as we continue our legacy of microprocessor innovation and create optimized solutions for Linux, Android and other key software platforms."
Prior to joining MIPS Technologies, Mr. Cherukuri was co-founder and vice president of engineering of Sonoa Systems, an infrastructure provider of analytics, management and governance solutions for cloud services and APIs. Prior to Sonoa, Mr. Cherukuri was on the founding team and managed ASIC and hardware development for Siara Systems, a KPCB funded company acquired by Redback Networks in 2000. Previously, Mr. Cherukuri spent eight years at Nexgen Microsystem/AMD, where he was a key designer of AMD's K6 microprocessor and also led the K7 chipset (Irongate) development effort. Before that, Mr. Cherukuri was an engineer with HCL Infosystems Ltd., working on architecture and implementation of the company's flagship Magnum multiprocessor platform. Mr. Cherukuri holds a Bachelor's degree in Engineering from IIT Roorkee and a TRIUM Global EMBA jointly offered by NYU Stern, London School of Economics and HEC, Paris. He holds 19 approved U.S. patents in the fields of computer architecture and networking.
About MIPS Technologies, Inc.
MIPS Technologies, Inc. (Nasdaq: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.
|
Related News
- MIPS Technologies Names Vice President of Engineering
- MIPS Technologies Names Gideon Intrater Vice President of Marketing
- Innovative Silicon Names Michael Van Buskirk Senior Vice President of Engineering and Operations
- Virage Logic Names Sherif Sweha as Vice President of Engineering
- The TPL Group Names F. Eric Saunders Chief Counsel for Intellectual Property (IP) and Dennis Miller Vice President of IP Development Engineering
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |