2.5D GPU / 2D & 3D Vector Graphics (OpenVG) Accelerator - D/AVE HD
Tensilica and Iberium Partner for Solutions for DTV Market
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA and SAN FRANCISCO, Calif. - May 25, 2010 -Tensilica, Inc. and Iberium Communications, Inc. today announced that they have established a partnership to develop solutions for digital television (DTV). Tensilica is the leading provider of dataplane processors (DPUs) for system-on-chip (SOC) designs. Iberium is a leader in semiconductor IP cores for DTV.
"We entered into this partnership because we foresee a need to provide flexible, multi-standard IP solutions for the increasing number and complexity of worldwide DTV standards," stated Slobodan Simovich, Iberium's CEO. "Tensilica's DPU technology is a superior programmable platform that delivers performance and power efficiencies 10 to 100X greater than legacy CPU or DSP platforms."
"We are pleased to partner with Iberium because of both their great expertise in DTV standards and their broadband DTV interoperability testing acumen," stated Steve Roddy, Tensilica's vice president of marketing and business development. "With the rapid proliferation of digital television standards and DTV-enabled products, it makes sense for Tensilica to partner with a leader that has application-specific expertise in this field."
About Iberium Communications
Iberium Communications is a San Francisco, Calif., based company with engineering offices in Doylestown, Penn., engaged in the design, development and marketing of semiconductor IP cores for the reception of DTV signals for multiple transmission standards. Iberium's demodulator technologies yield superior performance and smaller chip sizes than today's market leaders. For more information, visit www.iberiumcommunications.com.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- CAST and Shikino High-Tech Partner to Expand Silicon IP Offerings and Market Reach
- Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
- Andes Enters RISC-V CPU IP Market in India with Partner Excelmax
- CEVA and Mimi Hearing Technologies Partner to Democratize Assistive Hearing for the True Wireless Earbuds Market
- CFX Technology partners with Design&Reuse for further implementing IP design and market development
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |