SpringSoft's Laker Layout Supports TSMC 40-nm Technology with Interoperable Process Design Kit
HSINCHU, Taiwan -- May 25, 2010 -- SpringSoft, Inc. (TAIEX:2473), a global supplier of specialized IC design software, today announced support for the 40-nanometer (nm) interoperable process design kit (iPDK) introduced by TSMC. This builds on SpringSoft’s support of the industry’s first iPDK developed by TSMC for its 65-nanometer (nm) RF process technology. Both the 40nm and 65nm TSMC iPDKs will be available for production use with the Laker™ Custom Layout Automation System by the end of the second quarter 2010.
The collaboration between the two companies is driven by their mutual support of interoperable PDKs to provide custom chip designers with manufacturing flexibility, technology choice, and design productivity. SpringSoft is a founding member of the Interoperable PDK Library Alliance (IPL) and validation partner for the TSMC 65nm iPDK.
“We are working with a broad spectrum of leading vendors like SpringSoft to ensure that the iPDK achieves the vision of open and interoperable PDKs. In this way, TSMC can support every customer's optimal design flow by enabling them to use best-in-class tools throughout the design process," commented Tom Quan, deputy director of design methodology and service marketing at TSMC.
“Our support of the TSMC 65nm iPDK and now the 40nm iPDK is a testament to our ongoing efforts to provide the most complete, open and interoperable design solutions,” said Duncan McDonald, director of custom IC product marketing for SpringSoft. “Our joint effort with the IPL to produce an interoperable standard for PDKs gives custom design engineers the flexibility and productivity they need to achieve better results faster.”
About Laker Custom IC Design
Laker custom IC design solutions offer the power of controllable automation and unmatched interoperability to achieve superior layout results with less effort for analog, mixed-signal, and custom digital designs. More than 300 companies, including many of the world’s leading semiconductor companies, have adopted the Laker layout system for designs down to 28 nanometers. For more information about Laker products, visit: http://www.springsoft.com/products
About SpringSoft
SpringSoft, Inc. is a global supplier of specialized automation technologies that accelerate engineers during the design, verification and debug of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Its award-winning product portfolio features the Novas™ Verification Enhancement and Laker Custom IC Design solutions used by more than 400 of today's leading IDM and fabless semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, and San Jose, California, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with more than 400 employees located in multiple R&D sites and local support offices around the world. For more information, visit www.springsoft.com.
|
Related News
- Magma's Titan Mixed-Signal Platform Supports TSMC's 65- and 40-nm Interoperable Process Design Kits (iPDKs)
- GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK) Support for 22FDX
- Synopsys and TSMC Collaborate to Develop Integrated IoT Platform for TSMC 40-nm Ultra-Low-Power Process
- TSMC's Extremely Low Leakage Devices on 180nm eLL process empowers Dolphin Integration's IP offering
- SiliconBlue's New "Los Angeles" 40-nm Ultra-Low-Power 640, 1K and 4K LP and HX Devices Sampling
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |