CEVA Partners with Infineon Technologies for Next-Generation Wireless Platforms
Infineon adopts CEVA-TeakLite-III DSP for future mobile phone and modem platforms
SAN JOSE, Calif., June 7, 2010 -- CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Infineon Technologies today announced the Companies have extended their long-term strategic relationship to include the dual MAC, 32-bit CEVA-TeakLite-III DSP core for the future mobile phone and modem platform solutions from Infineon.
This latest agreement enables Infineon to leverage the superior features and processing performance offered by the latest generation CEVA-TeakLite-III DSP architecture while maintaining code compatibility with the existing CEVA-based Infineon architectures. The CEVA-TeakLite-III delivers industry-leading DSP performance required for advanced modem, voice and audio processing while maintaining low power and small die size.
"DSP plays an essential role in overall power consumption and performance in handsets and the CEVA-TeakLite-III DSP brings to Infineon the capability to dramatically improve future wireless and multimedia processor designs," said Gideon Wertheizer, CEO of CEVA. "We look forward to continuing our long standing partnership with Infineon to advance their leadership in mobile phone and modem platforms."
CEVA's industry-leading DSP cores power many of the world's leading handsets today, with all top five handset OEMs shipping CEVA-powered phones. To date, more than 700 million CEVA-powered handsets have shipped worldwide spanning the entire value chain, from ultra-low cost devices through to smartphones. Addressing next-generation 4G terminal and infrastructure markets, CEVA's latest generation DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance multimode 2G/3G/4G solutions.
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
|
Ceva, Inc. Hot IP
Related News
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research
- Infineon's HYPERRAMâ„¢ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
- Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge"
- Ambiq Micro's Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA's Bluetooth Low Energy IP
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |