Hynix Licenses Apical's Imaging Cores for its Next Image Sensor Products
LONDON, June 8, 2010 -- Apical Ltd and Hynix Semiconductor Inc have entered into a licensing agreement for the use of Apical's iridix and sinter image processing IP cores in future Hynix image sensor products.
iridix provides sophisticated dynamic range correction, based on original research into the way the human eye adapts to different lighting environments. An image sensor SoC ("System-on-Chip") integrating iridix gives natural-looking still images and video without need for additional post-processing.
Apical's iridix has formed the basis for many well-known product features in DSLRs, compact cameras and mobile phones. The iridix version 7 IP core combines professional/broadcast -level image quality with compact, low-power hardware implementation suitable for any digital imaging device.
sinter is a state-of-the-art noise reduction core which effectively addresses the primary noise sources affecting image quality in CMOS sensors. Originally developed for DSLRs, it has been further developed to tackle the particular noise characteristics of compact high-megapixel sensors used in mobile phones.
Says Michael Tusch, CEO Apical: "We are very glad to be working with Hynix and believe that using our technology will help Hynix to achieve strong market penetration with its future products."
About Apical
Apical is the industry leader in advanced dynamic range management and noise reduction technology for embedded applications. The company's products are derived from research into the human visual system and are designed to maximize the performance of a wide range of image capture and display devices. The product range comprises hardware IP cores and embedded software libraries. Apical is a privately-held company based in the UK. http://www.apical.co.uk
|
Related News
- Apical licenses iridix image processing cores to Texas Instruments
- Samsung licenses Apical's iridix IP core for semiconductor imaging products
- Israel's Vayyar Imaging Licenses Sonics NoC For Use in 3D Sensor Chips
- Almalence Ports Optimized Image Processing Software onto Tensilica's New IVP Imaging/Video DSP
- Sidense 1T-OTP Helps Calibrate Aptina's Advanced Imaging Products
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |