Texas Instruments delivers industry's first discrete SuperSpeed USB 3.0 transceiver, offering more than 10 times the speed of USB 2.0
Broadest portfolio of SuperSpeed USB devices spans power, protection and control
DALLAS, June 28, 2010 -- Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the industry's first SuperSpeed USB (USB 3.0) transceiver, which is capable of lightning-fast data transfers when compared to USB High-Speed devices (USB 2.0). Featuring receiver sensitivity that is twice as good as required by the USB 3.0 specification, the TUSB1310's PIPE3 and ULPI interfaces enable USB 3.0 functionality when used in conjunction with the integrated application processor digital cores. The 5-gigabits-per-second (Gbps) USB 3.0 physical layer transceiver operates from a single crystal or external reference clock with selectable frequencies from 20, 25, 30 and 40 MHz. This allows the TUSB1310 to provide a cost-effective USB 3.0 solution with few external components and minimum implementation cost. For more information or to order samples, see www.ti.com/tusb1310-pr.
"End users are demanding the ability to store huge photo and high-definition video files on their portable consumer devices with ease and speed," said Steve Anderson, senior vice president over TI's High-Performance Analog business unit. "The TUSB1310 is capable of completing data transfers of a 27 Gigabit Blu-ray™ disc in less than 90 seconds, versus nearly 15 minutes with USB 2.0. Using TI's complete SuperSpeed USB portfolio, engineers can design faster, more cost-effective and user-friendly consumer products for today and in the future."
The TUSB1310 supports many applications, including surveillance cameras, multimedia handsets, smartphones, digital still cameras, portable media players, personal navigation devices, audio docks, video IP phones, wireless IP phones and software defined radios. TI offers the industry's most expansive portfolio of SuperSpeed USB devices. Key available devices are the SN65LVPE502, a dual-channel USB 3.0 redriver/equalizer; the TPD2EUSB30, a two-channel ESD solution for SuperSpeed USB 3.0 interface; and the highly accurate TPS25xx series of USB power switches. Future offerings include peripherals, bridges, hubs, and hosts.
Key features and benefits
- Receiver sensitivity of less than 50 mV differential peak-to-peak for detecting weak signals is twice as good as the specification requirement, allowing use of longer cables and easing board layout challenges.
- Flexible, integrated spread-spectrum clocking can reduce BOM cost by five percent or more.
- Industry-standard link layer interfaces (PIPE3 for USB 3.0 & ULPI for USB 2.0 compatibility) enable easy system integration to a wide variety of attached digital cores.
Availability and packaging
The TUSB1310, TPD2EUSB30 and SN65LVPE502 are available now from TI and its authorized distributors. The TUSB1310 is packaged in a 175BGA and pricing starts at $6.00 in 1,000-unit quantities; the TPD2EUSB30 is packaged in a SOT (DRT) and pricing starts at $0.15 in 1,000-unit quantities; and the SN65LVPE502 is packaged in a QFN and pricing starts at $4.25 in 1,000-unit quantities.
Learn more about TI's interface portfolio at the links below:
- Order TUSB1310 samples: www.ti.com/tusb1310-pr.
- See a real-time download comparison between USB 3.0 and USB 2.0: www.ti.com/usb3video-pr.
- Quickly search TI's entire interface portfolio or download the latest selection guide: www.ti.com/interface-pr.
- Ask questions and help solve problems with fellow engineers in the TI E2E™ Community: www.ti.com/interfaceforum-pr.
- Follow USB expert, Dan Harmon, in his SuperSpeed USB blog: www.ti.com/usb3blog-pr.
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com
|
Related News
- Unveiling Silicon-proven USB 3.0 PHY IP Core in 22nm, Elevating High-Speed Data Transmission with Advanced Transceiver Technology, backward compatible with USB 2.0
- USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing
- Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution
- Silicon Line Announces the World's First 10 Gbps Transceiver for USB 3.0 and USB 3.1 Active Optical Cables
- Synopsys' New Silicon-Proven DesignWare USB 3.0 and USB 2.0 femtoPHY IP Cut Area by 50 Percent
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |