GSA Announces Infrastructure to Ease Third-Party IP Licensing Process for Semiconductor Industry
SAN JOSE, Calif. -- (July 12, 2010) – GSA, the voice of the global semiconductor industry, today announces its plans to help third-party IP buyers and sellers reduce costs and shorten the IP negotiation cycle with a new IP Licensing Best Practices survey and report.
GSA’s IP Interest Group formed an IP Licensing Working Group after responding to the industry’s need for a deliverable that will ease the third-party IP buying and selling process. The group’s first deliverable is a survey for companies to use as an objective measure of actual industry license practices and incorporate these practices, as appropriate, into current licensing activity.
“We’re excited that the working group was able to come together to create an infrastructure that provides IP buyers and suppliers valuable information about industry IP licensing norms,” said Warren Savage, president and chief executive officer of IPextreme, and chairman of GSA’s IP Interest Group. “We expect the information obtained in this quarterly report to become a valuable resource to the semiconductor industry for years to come.”
The IP Licensing Best Practices report is an on-going reflection of actual terms and conditions implemented by peers that buy and sell third-party IP for integration into systems-on-chip and covers three main areas:
- Warranty
- Indemnification
- Total Liability Limitation
The survey is currently open for all 2Q 2010 IP contract negotiations. All survey results will be confidential. Only participating companies will receive the aggregated and analyzed results. To participate in the survey, visit: www.gsaglobal.org/surveys/ip_licensing_best_practices/index.asp.
About GSA:
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org
|
Related News
- Government of India creating enabling environment for Semiconductor Design Community with direct access to National Chip Design Infrastructure
- Certus Semiconductor releases I/O library in TowerJazz's 65nm process
- Synopsys Advances Automotive Security with Industry's First IP Product to Achieve Third-Party Certification for ISO/SAE 21434 Cybersecurity Compliance
- Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
- Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |