Samsung First to Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology
SEOUL, South Korea--July 21, 2010--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first two-gigabit (Gb) Green DDR3 using 30 nanometer (nm) class* process technology.
“We’re seeing a sharp rise in demand for DDR3 chips and are meeting that need with the timely introduction of 30nm-class Green DDR3 solutions,” said Soo-In Cho, president, Memory Division, Semiconductor Business, Samsung Electronics. “Thirty nano-class DDR3 DRAM will deliver the most satisfying user experience possible, offering extremely high performance and reduced power consumption for PC and server applications designed to capitalize on new multi-core processors.”
Samsung’s 30nm-class 2Gb Green DDR3 chips provide the highest performance solution in the industry, based on an innovative circuit design. For server applications, memory modules can reach up to 1.866 gigabits per second (Gbps) at 1.35 volts, while PC modules can run at up to 2.133Gbps (1.5 volts), which is 3.5 times faster than DDR2 and 1.6 times faster than 50nm class DDR3.
Recent growth in the smartphone market has triggered a sharp increase in data usage, leading to heavier traffic in data centers. Samsung’s new 30nm-class DDR3 chip will provide memory solutions with the highest performance and lowest power levels to accommodate the new generation of servers optimized for cloud computing and virtualization. Power savings for most new server applications using 30nm DDR3 will be about 20 percent greater than applications that use 50nm-class DDR3.
In addition, when combined with new multi-core PC platforms, Samsung 30nm-class 4GB DDR3 solutions for PCs can operate 60 percent faster than two 50nm-class 2GB DDR3 solutions, using 65 percent less power.
Using the new 30nm-class process, the new chip provides a 155 percent overall increase in productivity over Samsung’s 50nm-class process.
With plans to also produce the new 30nm DDR3 chips in a 4Gb density by year end, Samsung will soon broaden its memory line-up with mass production of 4GB, 8GB, 16GB and 32GB 30nm-class RDIMMs for servers, 2GB, 4GB and 8GB UDIMMs for workstations and desktop PCs, plus 2GB, 4GB and 8GB SoDIMMs for notebooks and all-in-one desktops
For more information about Samsung Green DDR3, visit www.samsung.com/GreenMemory
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2009 consolidated sales of US$116.8 billion. Employing approximately 188,000 people in 185 offices across 65 countries, the company consists of eight independently operated business units: Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, Digital Imaging, Semiconductor and LCD. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs. For more information, please visit www.samsung.com.
|
Related News
- Samsung First to Begin Mass Producing 2-Gigabit DDR3 Using 40nm Class Technology
- Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM
- Samsung Develops Most Advanced Green DDR3 DRAM, Using 30nm-class Technology
- Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
- Samsung Begins Mass Producing Industry's Highest Density (128GB) Embedded NAND Storage
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |