Nujira licenses its Coolteq.L handset technology to a Tier 1 semiconductor vendor
Cambridge, UK -- August 16, 2010 - Nujira today announced that it has licensed its Coolteq.L handset technology to a Tier 1 semiconductor vendor in the handset ecosystem. Coolteq is an envelope tracking based technology that dramatically increases the power efficiency of transmitters in cellular handsets, network infrastructure, digital broadcasts and military communications.
Under the agreement, the vendor will integrate Nujira's Coolteq.L technology into production solutions addressing 3G, 3.5G and 4G technologies such as LTE. The name of the vendor and the value of the agreement were not disclosed, but Nujira did state that the terms include multi-million dollar license fees and per-unit royalties. A top five handset OEM has already signed a purchase agreement for the Coolteq.L development platform, and the company is in talks with other major OEMs and component manufacturers.
"This agreement with one of the market leaders in the mobile handset arena will see Nujira's technology integrated into hundreds of millions of mobile handsets," said Tim Haynes, CEO, Nujira. "As mobile internet data rates increase, Power Amplifier efficiency is becoming a dominant factor in the power consumption of smartphones and USB modems. Coolteq.L is the only power optimisation technology which delivers the high bandwidths needed for 3.5G and 4G. By partnering with leading ecosystem vendors, we can bring our world-leading technology to the handset market, and deliver real value to product designers and end-users alike."
Nujira demonstrated working Coolteq.L test silicon at MWC in February, and showed that a handset PA with Coolteq.L is twice as efficient during HSUPA and LTE transmissions, and 50% more efficient during W-CDMA transmissions, compared with the same PA without Coolteq. It also announced the formation of the OpenET Alliance to develop and publish open specifications for envelope tracking interfaces for 3G and 4G platforms.
|
Related News
- CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor
- Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company
- Lattice Semiconductor and Mikroprojekt Deliver Advanced System Development Platform for the Network Edge
- Lauterbach and Beyond Semiconductor Partner for Easier System Development with BA22 Royalty Free 32-bit Processors
- AMD Licenses NAND Flash System Solution From Denali for Next-Generation Handset Processor Products
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |