Nujira licenses its Coolteq.L handset technology to a Tier 1 semiconductor vendor
Cambridge, UK -- August 16, 2010 - Nujira today announced that it has licensed its Coolteq.L handset technology to a Tier 1 semiconductor vendor in the handset ecosystem. Coolteq is an envelope tracking based technology that dramatically increases the power efficiency of transmitters in cellular handsets, network infrastructure, digital broadcasts and military communications.
Under the agreement, the vendor will integrate Nujira's Coolteq.L technology into production solutions addressing 3G, 3.5G and 4G technologies such as LTE. The name of the vendor and the value of the agreement were not disclosed, but Nujira did state that the terms include multi-million dollar license fees and per-unit royalties. A top five handset OEM has already signed a purchase agreement for the Coolteq.L development platform, and the company is in talks with other major OEMs and component manufacturers.
"This agreement with one of the market leaders in the mobile handset arena will see Nujira's technology integrated into hundreds of millions of mobile handsets," said Tim Haynes, CEO, Nujira. "As mobile internet data rates increase, Power Amplifier efficiency is becoming a dominant factor in the power consumption of smartphones and USB modems. Coolteq.L is the only power optimisation technology which delivers the high bandwidths needed for 3.5G and 4G. By partnering with leading ecosystem vendors, we can bring our world-leading technology to the handset market, and deliver real value to product designers and end-users alike."
Nujira demonstrated working Coolteq.L test silicon at MWC in February, and showed that a handset PA with Coolteq.L is twice as efficient during HSUPA and LTE transmissions, and 50% more efficient during W-CDMA transmissions, compared with the same PA without Coolteq. It also announced the formation of the OpenET Alliance to develop and publish open specifications for envelope tracking interfaces for 3G and 4G platforms.
|
Related News
- CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor
- Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company
- Lattice Semiconductor and Mikroprojekt Deliver Advanced System Development Platform for the Network Edge
- Lauterbach and Beyond Semiconductor Partner for Easier System Development with BA22 Royalty Free 32-bit Processors
- AMD Licenses NAND Flash System Solution From Denali for Next-Generation Handset Processor Products
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |