English
Market shows signs of soft spots, says NXP's Clemmer
Peter Clarke, EETimes
8/17/2010 7:16 AM EDT
LONDON – NXP BV, which has closed several fabs in recent quarters, could not meet demand for its chips in the second quarter. But Rick Clemmer, the company's CEO, is not worried that this will allow others to capitalize in Q3 at NXP's expense. While chip demand remains generally healthy there are some market signs of soft spots and Clemmer said that Q3 2010 may not be the sales bonanza Q3 provides in most years.
In its financial results for Q2 NXP (Eindhoven, The Netherlands) said it does not expect manufacturing capacity additions being put in place will impact the third quarter to a significant degree and as such predicted flat sales in Q3.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
NXP Hot IP
Related News
- Lossy Imagination Says There's Good Signs in Graphics
- NXP Secure Element Adopted by Samsung Galaxy S6 in World's Largest Smartphone Market
- TowerJazz Signs MOU for Process Transfers and Projects in India and Brazil, Targeting India's Emerging Semiconductor Market
- NXP Shows World's Smallest 32-bit ARM Microcontroller
- Chip market to slow in second half, says TSMC's Chang
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards