SiliconBlue Ships Highest Logic Capacity FPGA in 6x6 mm Footprint Package

Update: Lattice Semiconductor to Acquire SiliconBlue (Dec 09, 2011)

5x5 and 6x6 mm BGA package additions to iCE65 mobileFPGA family offer high logic capacity and maximum I/O without compromising board space

SANTA CLARA, Calif. -- August 23, 2010 -- SiliconBlue® Technologies, a leading provider of custom mobile devices for consumer handset applications, today announced immediate availability of two new device packages for its iCE65™ mobileFPGA™ family. The iCE65L01 device with 1,280 logic cells is now offered in a 5x5 mm, 81-ball BGA package with 63 user I/O pins, and the iCE65P04 device with 3,520 logic cells is now offered in a 6x6 mm, 121-ball BGA package with 95 user I/O pins.

Today’s mobile designers face a daunting challenge. They must deliver a new mobile handset with innovative and differentiating features every year. Unfortunately, today’s application processors take approximately 2-3 years to develop and may still not include the functions the designer needs. In addition, these new features require plentiful logic coupled with additional I/O, which the application processor may not offer. By using SiliconBlue’s iCE65 mobileFPGA devices, designers can add new features to their mobile handset by complementing their existing applications processor, enabling fast innovation in the highly competitive mobile market.

Kapil Shankar, CEO of SiliconBlue said, “Our experience with the mobile handset market has taught us that in order to implement feature-rich functions, designers often need high logic capacity and maximum I/O, all in a small footprint package. These new devices, along with our wildly successful wafer-level chip scale packages are in demand for implementing a number of features including gyros, accelerometers, and dual displays.”

Availability

The iCE65L01F-TCB81 and the iCE65P04F-TCB121 are available immediately in volume production.

About SiliconBlue

SiliconBlue Technologies is a pioneer and leader in custom mobile devices for the consumer handset market. The company offers mobileFPGAs, a new class of ultra-low power, single-chip, SRAM FPGAs with non-volatile configuration memory (NVCM), designed specifically for handheld consumer applications. The company is headquartered in Santa Clara, California, with offices in Taiwan, China, Korea, and Japan. For more information, please visit our website at http://www.siliconbluetech.com.