Alvand Technologies Announces Ultra Low Power, Small Die-Area Analog-to-Digital Converter (ADC) Intellectual Property (IP) Solution in Advanced 40nm Process Node
Best-in-class, production-ready ADC technology from Alvand Technologies is ideally suited for cost-effective, energy-efficient Digital TV, digital imaging and wireless / wireline LAN applications
Santa Clara, Calif. – Sep.14th, 2010 – Alvand Technologies, Inc., a leading provider of mixed-signal ASIC and IP solutions, announces the production-readiness of the industry’s lowest power, smallest die-area analog-to-digital converter (ADC) intellectual property (IP) for advanced digital TV (DTV), digital imaging and wireless/wireline LAN applications. Designed in leading 40nm manufacturing process node, the ALVADC10_165M40THLA IP solution from Alvand is a robust 10-bit, 165 Mega-samples-per-second (MSPS) pipeline ADC that features excellent dynamic range performance, with a signal-to-noise ratio (SNR) of 56 dBFS, and high immunity to substrate noise.
Alvand’s ALVADC10_165M40THLA is one of the industry’s lowest power IP. It consumes 13mW at 165MSPS, which represents a 2x to 3x power savings over competitive offerings. In addition, Alvand’s IP solution features the industry’s one of the smallest die area of 0.06mm2 in 40nm, which is up to 5x smaller than competitive solutions, as well as having small pitch of about 150um. The combination of ultra low-power and small die area enables customers to develop high-performance systems that require a high density of multi-channel ADCs on chip, as well as highly energy efficient solutions for power-sensitive portable and mobile devices.
Based on Alvand’s patented ADC technology, the best-in-class ALVADC10_165M40THLA IP has been integrated successfully and will soon be ramping into production. The ALVADC10_165M40THLA IP complements Alvand’s existing portfolio of high-performance, ultra low-power ADC and analog front end (AFE) IP solutions that are shipping in volume production by multiple customers.
“We are committed to deliver high-performance, ultra-low power and small die-area A/D and D/A converters in advanced technologies,” said Mansour Keramat, President and CEO at Alvand Technologies. “This is the fifth consecutive process node (180nm, 130nm, 90nm , 65nm and now 40nm) in which we have demonstrated clear market and technology leadership in advanced ADC solutions, as evidenced by multiple industry recognitions we have received, and we expect our leadership to continue into the 28nm node soon.”
About Alvand Technologies
Alvand Technologies is a leading analog IC design company that specializes in high-speed, low-power, and ultra small die area data converters (ADC/DAC) and Analog Front End (AFE) for a broad range of applications, such as wireless (Wi-Fi, WiMAX, LTE) systems, ultrasound and mobile TV. Alvand also provides full turnkey mixed-signal ASICs based on its high performance and low power IPs. Alvand's seasoned team of analog and mixed-signal IC designers has extensive experience in high-performance analog and mixed-signal IC design with particular emphasis on ultra low power applications. For more information visit us at http://www.alvandtech.com.
|
Related News
- Alvand Technologies Announces Industry's Lowest Power, Smallest Die-Area Analog-to-Digital Converter (ADC) Intellectual Property (IP) Solution in Advanced 65nm Process Node
- 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing
- Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP Core with Time-Interleaved Pipeline Architecture Now Available for Whitebox Licensing with No Royalty Fees
- eMemory's NeoEE Technology Advanced into BCD Process Platform, Augment P-Gamma Silicon Intellectual Property Product Range and Accelerate the Integration Power Management ICs
- Cosmic Circuits introduces industry's lowest power 10-bit 1MSPS ADC IP-block in 0.13um process
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |