Inside Intel's Sandy Bridge architecture
Rick Merritt, EETimes
9/13/2010 9:17 PM EDT
SAN JOSE, Calif. – Intel has officially entered the race to heterogeneous computer processors, sketching out the first members of its Sandy Bridge family that will ship before April. The 32nm chips will come in versions with two or four dual-threaded x86 cores and one graphics core on a shared ring interconnect.
The first Sandy Bridge parts are aimed at notebooks, desktops and single-socket servers. Versions with more cores aimed at multi-socket servers will follow later in the year or early in 2012.
The Intel CPUs will compete head on with parts from archrival Advanced Micro Devices such as Ontario, a 40nm CPU using two of AMD's new Bobcat cores and a Microsoft DirectX11-class graphics core. Ontario is sampling now, and AMD has similar desktop and server chips in the works for the second half of 2011.
E-mail This Article | Printer-Friendly Page |
|
Related News
- UBM TechInsights takes first look inside Intel's latest Ivy Bridge processor
- Intel's Ivy Bridge delayed says senior executive
- LatticeECP2M FPGA Enables Low Cost PCI Express Bridge for VOIP Platforms Based on Intel Architecture
- Intel Demonstrates Industry's First 32nm Chip and Next-Generation Nehalem Microprocessor Architecture
- Intel's XScale architecture debuts in network-processor chip set
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards