Light Peak panned by OEM, report
Rick Merritt, EETimes
9/22/2010 10:51 AM EDT
SAN JOSE, Calif. – Intel's first implementation of Light Peak will not be broadly adopted by PC makers, but it opens a door to future optical interconnects. That's the view of an engineer in one top-tier PC company and an analyst report published separately today.
PC makers are ramping up for a significant transition to the copper-based USB 3.0 that can deliver data at more than 3 Gbits/second. Most have no plans to use the 10 Gbits/second Light Peak, said a senior engineer at one top-tier PC maker who asked not to be named.
"I think there will be some who will use Light Peak, but not the volume OEMs like the Acers, HPs and Dells," said the PC engineer. "They won't have a need for it," he said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- For notebooks, Light Peak is in, USB 3.0 is out? Join the conversation
- Fast interfaces overlap at IDF
- USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing
- M31 Technology and Corigine have launched the world's first USB-IF certified 28 nm Superspeed+ USB 3.1 Gen 2 IP Solution
- Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP With M31 28nm PHY
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era