Process Detector (For DVFS and monitoring process variation)
IBM 'fab club' denies problems with high-k
Mark LaPedus, EETimes
9/27/2010 8:31 PM EDT
SAN JOSE, Calif. - Members of IBM Corp.'s technology alliance, namely GlobalFoundries Inc. and Samsung Electronics Co. Ltd., dismissed a report that the group is struggling with its high-k/metal-gate technology.
High-k/metal-gate ''technology enables traditional scaling of the electrical gate dielectric and reduced standby power of transistor due to a reduction in gate leakage,''said Andrew Lu, an analyst with Barclays Bank, in a report.
''There has been a recent divergence in wafer processing technology to either choose 'gate-first' or 'gate-last' for (high-k/metal-gate),'' Lu said. ''Gate-first and gate-last are terms that refer to whether the metal gate electrode is deposited on wafer before or after the high-temperature activation anneals of flow processing.''
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Synopsys Announces Production-Ready Lynx Design System Optimized for Common Platform 28-nm High-K Metal Gate Technology
- GLOBALFOUNDRIES Launches Industry's First 28nm ARM Cortex-A9 Processor Platform with Gate First High-K Metal Gate
- Rumor mill: UMC to join IBM 'fab club'?
- It's Here: A Common Industry Framework for Protecting a Trillion Connected Devices
- IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset