First look inside iPhone 4 reveals high reuse
Rick Merritt, EETimes
6/24/2010 3:08 PM EDT
SAN JOSE, Calif.--You could call the new Apple iPhone 4 an iPad Nano because it uses at least seven chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone. STMicroelectronics won a coveted design win for its MEMS gyro in the handset.
The teardown specialist is preparing a full report on the iPhone 4. UBM TechInsights is a division of United Business Media, the publisher of EE Times.
Like the iPad, iPhone 4 uses Apple's A4 as its applications processor. However it uses a version with twice the memory—512 Mbytes of Samsung Mobile DDR SDRAM. Specifically the part uses the Samsung K4X4G643GB, a package-on-package stack of two 2 Gbit die.
E-mail This Article | Printer-Friendly Page |
Related News
- Augment your Peripheral slot's performance with the Low Power and High Throughput PCIe 4.0 PHY IP Cores in 12FFC with matching PCIe 4.0 Controller IP Cores
- Silex Inside releases a high throughput, scalable and performant MACsec engine
- iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
- PLDA Announces XpressRICH4-AXI PCIe 4.0 IP, Providing a High Performance and Reliable AXI Bridge for SoC designs
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models