First look inside iPhone 4 reveals high reuse
Rick Merritt, EETimes
6/24/2010 3:08 PM EDT
SAN JOSE, Calif.--You could call the new Apple iPhone 4 an iPad Nano because it uses at least seven chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone. STMicroelectronics won a coveted design win for its MEMS gyro in the handset.
The teardown specialist is preparing a full report on the iPhone 4. UBM TechInsights is a division of United Business Media, the publisher of EE Times.
Like the iPad, iPhone 4 uses Apple's A4 as its applications processor. However it uses a version with twice the memory—512 Mbytes of Samsung Mobile DDR SDRAM. Specifically the part uses the Samsung K4X4G643GB, a package-on-package stack of two 2 Gbit die.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Augment your Peripheral slot's performance with the Low Power and High Throughput PCIe 4.0 PHY IP Cores in 12FFC with matching PCIe 4.0 Controller IP Cores
- Silex Inside releases a high throughput, scalable and performant MACsec engine
- iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
- PLDA Announces XpressRICH4-AXI PCIe 4.0 IP, Providing a High Performance and Reliable AXI Bridge for SoC designs
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset