Dolphin Integration launches its new kit for ultra High Density audio converters
Meylan, France – November 12, 2010. For high volume applications, such as multimedia devices, cost reduction is a main concern when designing a System-on-Chip. Nevertheless, the challenge is that cost reduction must be achieved while increasing performances of the device.
Every way to reach this concern is welcomed by integrators.
Dolphin Integration addresses these concerns for its audio converters through a double approach.
To begin with, ultra low power consumption is reached by Dolphin's CODECs, while keeping their resolution high, thanks to its architectures Helium and Helium2. Early users turn-out as the market winners.
The reduction of silicon cost then is provided by a new architecture optimized for ultra High Density: Helium3uHD. Early winners then can keep their leadership.
Helium3uHD not only benefits from the low power of Helium architecture, but also from an improved density.
Gains are striking: more than38% of area savings between Helium kit and Helium3uHD kit for the configuration shCOD95-BT01 at 130 nm, while preserving the same low power consumption and 95 dB of SNR! http://www.design-reuse.com/sip/view.php?id=24856
Obviously, the kit Helium3uHD offers state-of the art peripherals, including optimized regulators. Integrators can choose their needed configuration from the kit thanks to the modularity of Dolphin’s design.
To learn more on this architecture, its modularity and to evaluate the configuration fitting your needs, please, contact jazz@dolphin.fr
About Dolphin Integration
Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components. The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own EDA solutions enabling Integration Hardware Modeling (IHM) and Application Hardware Modeling (AHM) as well as early Power and Noise assessment, plus engineering assistance for Risk Control.
For more information about Dolphin, visit: www.dolphin.fr/jazz
|
Dolphin Semiconductor Hot IP
Related News
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
- Dolphin Integration enables 1P3M/1P4M SoC designs at 180 nm with their ultra high density standard cell library
- Dolphin Integration introduces an ultra High Density Library decreasing the 130 nm logic area up to 30%
- Dolphin Integration announces an ultra High Density library in shrunk processes.
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |