7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Dolphin Integration launches its new kit for ultra High Density audio converters
Meylan, France – November 12, 2010. For high volume applications, such as multimedia devices, cost reduction is a main concern when designing a System-on-Chip. Nevertheless, the challenge is that cost reduction must be achieved while increasing performances of the device.
Every way to reach this concern is welcomed by integrators.
Dolphin Integration addresses these concerns for its audio converters through a double approach.
To begin with, ultra low power consumption is reached by Dolphin's CODECs, while keeping their resolution high, thanks to its architectures Helium and Helium2. Early users turn-out as the market winners.
The reduction of silicon cost then is provided by a new architecture optimized for ultra High Density: Helium3uHD. Early winners then can keep their leadership.
Helium3uHD not only benefits from the low power of Helium architecture, but also from an improved density.
Gains are striking: more than38% of area savings between Helium kit and Helium3uHD kit for the configuration shCOD95-BT01 at 130 nm, while preserving the same low power consumption and 95 dB of SNR! http://www.design-reuse.com/sip/view.php?id=24856
Obviously, the kit Helium3uHD offers state-of the art peripherals, including optimized regulators. Integrators can choose their needed configuration from the kit thanks to the modularity of Dolphin’s design.
To learn more on this architecture, its modularity and to evaluate the configuration fitting your needs, please, contact jazz@dolphin.fr
About Dolphin Integration
Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components. The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own EDA solutions enabling Integration Hardware Modeling (IHM) and Application Hardware Modeling (AHM) as well as early Power and Noise assessment, plus engineering assistance for Risk Control.
For more information about Dolphin, visit: www.dolphin.fr/jazz
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