Xilinx Enables Leading Wireless Platform & Semiconductor Company to Speed Wireless Products to Market With FPGA-Based Prototyping System
System allows company to quickly prototype ASSP designs & jumpstart software development
SAN JOSE, Calif., Nov. 16, 2010 -- Xilinx, Inc. (Nasdaq: XLNX) and ST-Ericsson, a world leader in wireless platforms and semiconductors, today announced that ST-Ericsson is developing a next-generation PEPS-2 application-specific standard product (ASSP) prototyping platform based on Xilinx's high performance Virtex(R)-6 FPGAs.
The new platform for emulation, prototyping and software development will include up to six high performance Virtex-6 FPGAs and will allow software development prior to ASSP silicon availability. ST-Ericsson deployed its first generation PEPS system, which included six Virtex-4 FPGAs, to develop its highly acclaimed U8500 Smartphone Platform.
The upcoming PEPS-2 system will allow customers to develop even larger and more complex ASSP platforms and run the system faster, with much lower power, due to the Virtex-6 FPGAs.
About Xilinx
Xilinx is the world's leading provider of programmable platforms. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
- HyperSilicon Releases Xilinx- XCVU440 Based FPGA-Based Prototyping Platform for VLSI (Very Large Scale Integration)Verification
- Aldec Enters the ASIC Prototyping Market with HES-7
- Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors
- Amlogic Reduces HW/SW Integration Time for Multimedia SoCs by Two Months Using the Cadence Protium S1 FPGA-Based Prototyping Platform
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |