NVM OTP NeoBit in Maxchip (180nm, 160nm, 150nm, 110nm, 90nm, 80nm)
TSMC Obtains Termination of ITC Investigation into 37nm and Smaller Products
Hsinchu, Taiwan, R.O.C. – November 16, 2010 - TSMC (TWSE:2330, NYSE:TSM) announced today that it was able to secure a favorable resolution to an International Trade Commission investigation for alleged patent infringement by its 28 nm process technology. The parties have filed a joint motion to terminate the ITC investigation titled In the Matter of Certain Semiconductor Products Made by Advanced Lithography Techniques and Products Containing Same, 337-TA-729, brought by STC.UNM, the licensing arm of the University of New Mexico.
The investigation alleged TSMC’s semiconductor process with critical dimensions of 37 nm or below of infringing U.S. Patent No. 6,042,998 (“’998 patent”). TSMC responded by denying the infringement allegations.
TSMC’s general counsel, Dr. Richard Thurston, remarked “While TSMC regrets that a case based upon an invalid and unenforceable patent such as STC’s made its way into the courts, TSMC is, however, pleased with the outcome of this case.”
|
Related News
- AppliedMicro Selects TSMC as Manufacturing Partner for ARM 64-bit SoCs On Advanced 40nm and 28nm Process Technology
- Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node
- Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
- Altera and TSMC Collaborate on 55 nm EmbFlash Process
- Dolphin Integration first to achieve 0.84 pA per bit in SpRAM at the 90 nm uLL embedded flash process
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
Most Popular
E-mail This Article | Printer-Friendly Page |