Renesas Electronics Introduces EMMA Mobile EV0-D SoCs for Portable Audio-Visual Devices with One-third Reduced Package
TOKYO, Japan, December 3, 2010 — Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced the availability of new system-on-chips (SoCs) that achieve playback of audio and video data in a single chip for portable audio-visual (AV) devices, including portable multimedia players, electronic book readers and network TVs.
The new SoCs are EMMA Mobile EV series products that incorporate the latest ARM Cortex™ A9 high-performance CPU and integrate on a single chip the functions necessary for MPEG2, MPEG4, and H.264 HDTV (1920 × 1080 pixels) video playback.
The new SoCs feature (1) a reduced package size by approximately one-third from the company's existing 16 × 16 millimeter (mm) to a 9 × 9 mm package, and (2) also includes DRAM within the same package. These features contribute to miniaturization of the systems and also facilitate design configuration by eliminating the need for high-speed DRAM interface design. However, to respond to a wide range of market needs, Renesas Electronics also has developed the EMMA Mobile EV0-S SoCs, that do not include DRAM.
The new SoCs make it possible to design portable AV devices, e-books and other embedded systems with high functionality and performance with faster time-to-market and at a low cost. Recently, a large number of diverse products in the portable and handheld space that reproduce multimedia data, such as portable multimedia players and e-books, have emerged, with market growth at an average rate of 10 percent per year, and is expected to reach 450 million units annually by 2013. Furthermore, TVs and other information equipment are evolving toward higher functionality and performance due to internet connectivity, thereby creating a new multimedia AV equipment market for devices with even higher levels of multimedia functionality.
Since the product life cycle in the multimedia AV market is short, competition is fierce, and the market has strong demands for the early release of semiconductor products that can implement compact mobile AV devices at low cost while providing necessary functions for multimedia data reproduction. Renesas Electronics' new SoCs were developed to meet these needs.
Main functions of the memory devices:
-
(1) Package size reduced by approximately one-third from existing SoCs
By adopting a system design optimized for market needs, Renesas Electronics was able to keep the chip size and pin count down to the absolute minimum. As a result, the company reduced the package size by approximately one-third that of the existing EMMA Mobile EV SoCs, from 16 × 16 mm package to 9 × 9 mm.
-
(2) DRAM included in the same package
Using SiP (system-in-package) technology, Renesas Electronics included optimal-size DRAM in the same package. In addition to supporting system miniaturization, this also obviates the need for designing a high-speed interface with an external DRAM and contributes to easier end-product circuit-board design.
Renesas Electronics positions these new SoCs as strategic products for the mobile AV field and plans to actively market them. Additionally, in cooperation with partner companies, Renesas Electronics also will provide an evaluation and development environment that reduce the system designers' development burden.
Further, Renesas Electronics plans to integrate the new SoCs into the company's “R-Mobile" series, which are SoCs for mobile devices developed through Renesas Electronics' new integrated SoC platform that integrates core technologies essential for the future networked society.
Pricing and Availability
Samples of Renesas Electronics' new EMMA Mobile EV0-D and EMMA Mobile EV0-S SoCs are scheduled for availability starting April 2011 with expected pricing of US$35 and US$30 per unit respectively in sample quantities. Mass production is scheduled to begin in October 2011 and is expected to reach 1,000,000 units per month. (Pricing and availability are subject to change without notice.)
Please refer to the separate sheet for the main specifications of Renesas Electronics' new SoCs.
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723), the world's number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at www.renesas.com.
|
Related News
- NEC Electronics and Wind River Expand Collaboration on Linux Solutions for Portable Audio/Visual Devices Market
- Renesas Electronics Introduces R-Car M1 Series of Integrated SoCs Developed for Mid-Range Automotive Infotainment Systems
- Renesas Electronics Introduces New SoC that Enables Industry-Leading 16-Megapixel Still Image and High-Speed Continuous Shooting for Mobile Phones
- Renesas Electronics Introduces New USB 3.0 Host Controller with 85 Percent Reduced Power Consumption
- NEC Electronics Introduces Cost-Effective EMMA SoCs with Built-In Support for Next-Generation H.264 Video Compression Standard
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |