TSMC to reportedly boost capex, build new fab
EETimes, 12/3/2010 6:22 PM EST
SAN FRANCISCO—Taiwan Semiconductor Manufacturing Co. Ltd. plans to increase its capital spending in 2011 compared to this year and is planning a new 300-mm fab in Taiwan that will open in 2015, according to reports emerging from the company's supply chain management forum.
Morris Chang, TSMC's chairman and CEO, said the foundry would boost capacity by more than 30 percent next year in order to meet customer demand, according to reports by Taipei Times and others. Chang also reportedly said TSMC would increase capital spending in 2011 from a projected $5.9 billion this year, though he declined to provide a number.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC in talks to build fab in Dresden
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
- TSMC to Build 3nm Fab in Tainan Science Park
- Why TSMC Wants to Build a 12-inch Wafer Fab in China
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era