TSMC to reportedly boost capex, build new fab
EETimes, 12/3/2010 6:22 PM EST
SAN FRANCISCO—Taiwan Semiconductor Manufacturing Co. Ltd. plans to increase its capital spending in 2011 compared to this year and is planning a new 300-mm fab in Taiwan that will open in 2015, according to reports emerging from the company's supply chain management forum.
Morris Chang, TSMC's chairman and CEO, said the foundry would boost capacity by more than 30 percent next year in order to meet customer demand, according to reports by Taipei Times and others. Chang also reportedly said TSMC would increase capital spending in 2011 from a projected $5.9 billion this year, though he declined to provide a number.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TSMC in talks to build fab in Dresden
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
- TSMC to Build 3nm Fab in Tainan Science Park
- Why TSMC Wants to Build a 12-inch Wafer Fab in China
Breaking News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
Most Popular
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- Mixel Announces the Opening of New Branch in Da Nang, Vietnam
- intoPIX and Nextera-Adeas Announce Latest IPMX Demo Design with JPEG XS on Compact FPGAs at ISE 2025
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies