English
What’s the cost for 3-D chips?
Mark LaPedus, EETimes
12/9/2010 6:46 PM EST
BURLINGAME, Calif. – What’s the biggest hurdle to bring 3-D chips based on through-silicon via (TSV) technology into mass production?
There are many, but cost is perhaps the big issue.
Antun Domic, senior vice president and general manager of the Implementation Group for Synopsys Inc., said the cost overhead for a TSV-based 3-D device is $150 per wafer. That is 5 percent of the total cost of a 300-mm wafer.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- AI Chips: What Will 2020 Bring?
- What is the cost of fabs and R&D at 22-nm?
- Tool Talk: Will 3D chips challenge SoCs?
- NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
- What does Renesas' acquisition of PCB toolmaker Altium mean?
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards