Powerchip Standardizes on SpringSoft's Laker Custom IC Layout for Design of High-Density Memory Chips
HSINCHU, Taiwan--January 04, 2011--SpringSoft, Inc., a global supplier of specialized IC design software, today announced that Powerchip Technology Corporation, a memory solution company based in Taiwan, has selected the Laker™ Custom Layout Automation System as the standard platform for memory chip design.
Powerchip offers large volume production of DRAM products, such as DDRIII/DDRII DRAMs, and has begun mass production of NAND Flash chips. With the easy-to-use tools and automated design flows of the Laker system, design teams in the Powerchip Technology Corp. (PTC) have increased productivity by as much as 20 percent.
By making Laker software available to more groups within its development organization, Powerchip can leverage the productivity gains and shorter development cycles to accelerate time-to-volume production of current generation memory products and new high-density memory chips.
“As a company, we are focused on enriching our product portfolio by enhancing its cost competitiveness,” said Su Lu, Ph D., vice president at Powerchip. “Laker’s focus on design excellence and saving time allows our development teams to meet aggressive product goals and delivery schedules.”
“Laker is a highly automated custom chip design environment with full-featured schematic editor, Magic Cell technology for automatic device generation, and complete schematic-driven layout flow to speed physical implementation,” said JT Li, vice president of the Physical Design Group at SpringSoft. “These capabilities are coupled with the highest possible levels of productivity and ease of use, so that Powerchip’s design and foundry service teams can stay focused on their core competencies and deliver superior memory solutions in less time.”
About Laker Custom IC Design
Laker custom IC design solutions offer the power of controllable automation and unmatched interoperability to achieve superior layout results with less effort for analog, mixed-signal, and custom digital designs. More than 300 companies, including many of the world’s leading semiconductor companies, have adopted the Laker layout system for designs down to 28 nanometers. For more information about Laker products, visit: http://www.springsoft.com/products.
About SpringSoft
SpringSoft, Inc. (TAIEX: 2473) is a global supplier of specialized automation technologies that accelerate engineers during the design, verification and debug of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Its award-winning product portfolio features the Novas™ Verification Enhancement and Laker Custom IC Design solutions used by more than 400 of today's leading IDM and fabless semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with more than 400 employees located in multiple R&D sites and local support offices around the world. For more information, visit www.springsoft.com.
|
Related News
- SpringSoft's Laker Custom IC Layout and Digital Routing Tools Gain Momentum in Memory Chip Market
- SpringSoft's Laker Leads the Way to SignOff-Driven Custom Layout Flow with Integration of Calibre RealTime
- Hynix Standardizes on SpringSoft's Verification Enhancement and Custom IC Design Solutions
- Winbond Adopts SpringSoft Laker Layout and Routing Systems for Design of High Performance, Low Power Memory Chips
- Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
Breaking News
- Alphawave Semi Partners with PCISig, CXL Consortium, UCIe Consortium, Samtec and Lessengers to Showcase Advances in AI Connectivity at Supercomputing 2024
- Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing Cloud-Based Live Production
- AI Software Startup Moreh Partners with AI Semiconductor Company Tenstorrent to Challenge NVIDIA in AI Data Center Market
- Achronix and BigCat Wireless Collaborate to Deliver Unprecedented Power Efficiency and Performance for 5G/6G Wireless Applications
- Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology
Most Popular
- LG and Tenstorrent Expand Partnership to Enhance AI Chip Capabilities
- Silicon Creations Celebrates Milestone with Delivery of 1,000th Production License for Fractional-N PLL
- Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology
- CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level
- Flex Logix Acquired By Analog Devices
E-mail This Article | Printer-Friendly Page |