English
450-mm fab schedule slips
Mark LaPedus, EETimes
1/24/2011 8:52 PM EST
SAN JOSE, Calif. – Despite a sudden surge in fab tool activity for the next-generation wafer size, 450-mm fabs will emerge later than sooner and the production target appears to have slipped.
This comes to no surprise to analysts, as the recent recession appears to have delayed 450-mm fab and tool investments. As reported, Intel, Samsung and TSMC have talked about having 450-mm prototype fabs by 2012. Intel Corp. is readying D1X, a 450-mm ''capable’’ fab. The new development fab in Oregon is slated for R&D startup in 2013.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X