Motorola and WiLAN Settle Litigation
OTTAWA, Canada – January 27, 2011 – Wi-LAN Inc. (“WiLAN” or the “Company”) (TSX:WIN), a leading technology innovation and licensing company, today announced that it has settled all pending patent litigation with Motorola, Inc. On January 4, 2011, Motorola, Inc. split into two companies; Motorola Solutions and Motorola Mobility. As a result of the settlement, both Motorola Solutions and Motorola Mobility have obtained multi-year licenses to WiLAN’s patent portfolio and each will make a series of fixed cash payments to WiLAN. Other terms of the agreement are confidential.Motorola Mobility is the 12th handset vendor to take a license to WiLAN’s portfolio.
The settlement includes the dismissal of all litigations between the companies in the U.S. District Court for the Eastern District of Texas.
About WiLAN
WiLAN, founded in 1992, is a leading technology innovation and licensing company. WiLAN has licensed its intellectual property to over 240 companies worldwide. Inventions in our portfolio have been licensed by companies that manufacture or sell a wide range of communication and consumer electronics products including 3G cellular handsets, Wi-Fi-enabled laptops, Wi-Fi/DSL routers, xDSL infrastructure equipment, WiMAX base stations and digital television receivers. WiLAN has a large and growing portfolio of more than 970 issued or pending patents. For more information: www.wilan.com.
|
Related News
- WiLAN and LG Settle Wireless Patent Litigation
- WiLAN and UTStarcom Settle Litigation
- Wi-LAN and Infineon Settle Patent Litigation
- Wi-LAN Amends Complaint to Add LG to Litigation Against Motorola, RIM and UTStarCom
- Wi-LAN Initiates Litigation Against Motorola, RIM and UTStarCom / Company confirms settlement of Marvell Dispute
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |