InterDigital Signs Acer to Worldwide Patent License Agreement
Agreement Covers 2G, 3G, and 4G Wireless Standards
KING OF PRUSSIA, Pa. -- January 31, 2011 -- InterDigital, Inc. (NASDAQ:IDCC) today announced that its patent holding subsidiaries have entered into a worldwide, non-transferable, non-exclusive, royalty-bearing patent license agreement with Acer, Inc., a multinational corporation headquartered in Taiwan. The products licensed under the agreement are designed to operate in accordance with 2G, 3G and 4G wireless technologies, including LTE, LTE-Advanced, and WiMax standards. "We are pleased to have entered into this patent license agreement with Acer, one of the world's leading consumer electronics companies," said Lawrence F. Shay, President of InterDigital's patent holding subsidiaries. "This license agreement demonstrates InterDigital's continuing strength in developing and licensing multiple generations of air interface technologies, including the emerging 4G wireless technologies."
About InterDigital
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. As a long-standing contributor to the evolution of the wireless industry, we solve many of the industry's most critical and complex technical challenges years ahead of market deployment. Our advanced solutions support more efficient wireless networks, a richer multimedia experience, and new mobile broadband capabilities. Accordingly, we have established licenses and partnerships with many of the world's leading wireless companies. For more information, visit: www.interdigital.com.
|
Related News
- InterDigital Signs Pantech to Worldwide Patent License Agreement Covering 2G, 3G and LTE Standards
- InterDigital and Fujitsu Limited Agree to Worldwide Patent License Agreement
- InterDigital and Sierra Wireless Expand Worldwide Patent License Agreement to Cover 4G Standards
- InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement
- InterDigital Signs Casio Hitachi Mobile Communications to Worldwide 2G and 3G Patent License Agreement
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |