TSMC 5nm (N5) 1.2V/1.8V/2.5V GPIO Libraries, multiple metalstacks
DesignCon: FPGA caveman lag in tools
Mark LaPedus, EETimes
2/1/2011 9:31 PM EST
SANTA CLARA, Calif. - FPGA vendors continue to keep pace with Moore’s Law.
Altera Corp. and Xilinx Inc. have separately announced new and complex 28-nm devices. Intel Corp. will lend its semiconductor process technology muscle to build FPGAs for programmable logic startup Achronix Semiconductor Corp. at 22-nm and beyond under the terms of a recent agreement between the two companies.
But with each new family, the gap between traditional design tools and the underlying silicon capabilities is expanding. Designers are frustrated by inefficient and tedious design tools. Major categories of challenges that designers face include verification, debug and integration with PCBs.
E-mail This Article | Printer-Friendly Page |
Related News
- QuickLogic Announces New Aurora™ FPGA/eFPGA User Tools with Enhancements for Reconfigurable Computing
- Microchip Slashes Time to Innovation with Industry's Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools
- Rapid Silicon's Raptor Software Out-Performs All EDA Tools in the Industry
- CHIPS Alliance Forms F4PGA Workgroup to Accelerate Adoption of Open Source FPGA Tooling
- Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program