SMSC's Inter-Chip Connectivity Technology Licensed by Leading Company
HAUPPAUGE, N.Y., Feb 15, 2011 -- SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems, announced today that Qualcomm Incorporated has licensed SMSC's patented Inter-Chip Connectivity(TM) (ICC) technology.
ICC enables the USB 2.0 protocol, which is now standard in billions of electronic devices, to be delivered over short distances consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining most of the software compatibility with an analog USB 2.0 connection. The High Speed Interconnect (HSIC) specification (an addendum to the USB 2.0 specification) includes the ICC technology. Where applicable, such as in portable applications, the ICC technology decreases power consumption and silicon area compared to an analog USB 2.0 interface.
Using its ICC license with SMSC, Qualcomm can develop devices that are compliant with the HSIC specification for both USB 2.0 host and USB 2.0 device applications.
About SMSC's ICC Technology
SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC's ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC's ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC. For information about licensing SMSC's patented ICC technology, please visit www.smsc.com/icc.
About SMSC
SMSC is a leading developer of Smart Mixed-Signal Connectivity(TM) solutions. SMSC employs a unique systems level approach that incorporates a broad set of technologies and intellectual property to deliver differentiating products to its customers. The company is focused on delivering connectivity solutions that enable the proliferation of data in personal computers, automobiles, portable consumer devices and other applications. SMSC's feature-rich products drive a number of industry standards and include USB, MOST automotive networking, Kleer wireless audio, embedded system control and analog solutions, including thermal management and RightTouch(TM) capacitive sensing. SMSC is headquartered in New York and has offices and research facilities in North America, Asia, Europe and India. Additional information is available at www.smsc.com.
|
Related News
- SMSC Inter-Chip Connectivity Technology Licensed by Samsung
- SMSC Inter-Chip Connectivity Technology Licensed by AMD
- SMSC Inter-Chip Connectivity Technology Licensed by NVIDIA
- SMSC's High Speed Inter-Chip (HSIC) USB4640 Available
- SMSC Launches Industry's First, Hi-Speed Inter-Chip USB 2.0 to 10/100 Ethernet Controller for Low Power Applications
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |