English
MIT, TI tip 28-nm processor
Mark LaPedus, EETimes
2/20/2011 9:05 PM EST
SAN FRANCISCO - At the 2011 International Solid-State Circuits Conference (ISSCC) here, Texas Instruments Inc. and the Massachusetts Institute of Technology (MIT) will outline what could be a major breakthrough in the gap between performance demands and battery capacity in the mobile space.
In a paper, TI and MIT will present research detailing design methodologies for a 28-nm mobile applications processor with ultra-low power. The paper-entitled ''A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Fujitsu Semiconductor ASIC Design for 2G/3G/4G Baseband Processor in Volume Production with Synopsys 28-nm MIPI M-PHY
- New Freescale 28-nm QorIQ AMP Series Processors Deliver High-End Features and Ultra-Low-Power Operation
- Adapteva close to sampling 28-nm, 64-core coprocessor
- Altera Introduces SoC FPGAs: Integrating ARM Processor System and FPGA into 28-nm Single-Chip Solution
- Improved ARM core, other changes in TI mobile app processor
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards